Publikační výsledky

• 2025

  SKÁCEL, J.; OTÁHAL, A. The influence of current on the structure of the intermetallic compound in solder alloys. Journal of Electrical Engineering-Elektrotechnicky Casopis, 2025, vol. 76, no. 1, p. 48-57. ISSN: 1335-3632.
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• 2023

  CHMELÍKOVÁ, L.; FECKO, P.; CHMELÍK, J.; SKÁCEL, J.; OTÁHAL, A.; FOHLEROVÁ, Z. Demolded hollow high aspect-ratio parylene-C micropillars for real-time mechanosensing applications. Applied Materials Today, 2023, vol. 31, no. 1, p. 1-12. ISSN: 2352-9407.
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  ADÁMEK, M.; MLČEK, J.; SKOWRONKOVÁ, N.; ZVONKOVÁ, M.; JAŠŠO, M.; ADÁMKOVÁ, A.; SKÁCEL, J.; BUREŠOVÁ, I.; ŠEBESTÍKOVÁ, R.; ČERNEKOVÁ, M.; BUČKOVÁ, M. 3D Printed Fused Deposition Modeling (FDM) Capillaries for Chemiresistive Gas Sensors. SENSORS, 2023, vol. 23, no. 15, p. 1-17. ISSN: 1424-8220.
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  OTÁHAL, A.; GABLECH, I.; SKÁCEL, J.; SZENDIUCH, I. Investigation of the Influence of Dam and Fill Encapsulating Material Shrinkage on a Semiconductor Substrate Warpage. In Proceedings of the International Spring Seminar on Electronics Technology. 2023. 5 p. ISBN: 979-8-3503-3484-5.
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• 2022

  BRANDEJS, P.; SKÁCEL, J. SCRATCH TESTER. In Proceedings II of the 28th Conference STUDENT EEICT 2022 Selected papers. 1. Brno: Brno University of Technology, Faculty of Electrical Engineering and Communication, 2022. p. 136-139. ISBN: 978-80-214-6030-0.
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• 2021

  OTÁHAL, A.; ŘEZNÍČEK, M.; SKÁCEL, J. Evaluation of Influence of Flux Residues After Rework and Repair Process of Underfilled BGA Packages. In 2021 44th International Spring Seminar on Electronics Technology (ISSE). Conference proceedings (International Spring Seminar on Electronics Technology). IEEE, 2021. no. 1, p. 1-4. ISBN: 978-1-6654-1477-7. ISSN: 2161-2536.
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  OTÁHAL, A.; SKÁCEL, J.; SZENDIUCH, I.; BÚRAN, M. Comparison of Sample Preparation with Microsection and FIB Depending on the Detail of Structure. In 2021 44th International Spring Seminar on Electronics Technology (ISSE). Conference proceedings (International Spring Seminar on Electronics Technology). IEEE, 2021. no. 1, p. 1-6. ISBN: 978-1-6654-1477-7. ISSN: 2161-2536.
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• 2020

  SZENDIUCH, I.; HEJÁTKOVÁ, E.; HURBAN, M.; SKÁCEL, J. Ecolabeling of Electronics Products – what is new and what next?. In Electronics Technology (ISSE), 2020 43rd International Spring Seminar. Conference proceedings (International Spring Seminar on Electronics Technology). Institute of Electrical andElectronics Engineering (IEEE). Košice, slovensko: IEEE Computer Society, 2020. no. 1, p. 151-154. ISBN: 9781538657300. ISSN: 2161-2536.
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  OTÁHAL, A.; SKÁCEL, J.; SZENDIUCH, I.; JANKOVSKÝ, J. Current Load of Thick-film Pastes for Power Applications. In 2020 43rd International Spring Seminar on Electronics Technology (ISSE). Conference proceedings (International Spring Seminar on Electronics Technology). IEEE, 2020. p. 1-6. ISBN: 978-1-7281-6773-2. ISSN: 2161-2536.
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  OTÁHAL, A.; SKÁCEL, J.; SZENDIUCH, I. Investigation of Metallographic Etchants Selectivity for Tin Solder Alloys. In 2020 43rd International Spring Seminar on Electronics Technology (ISSE). Conference proceedings (International Spring Seminar on Electronics Technology). IEEE, 2020. p. 1-6. ISBN: 978-1-7281-6773-2. ISSN: 2161-2536.
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• 2019

  OTÁHAL, A.; SKÁCEL, J.; SZENDIUCH, I. New Possible Way for Brazing of Thick Film Cermet Conductors. In 42nd International Spring Seminar on Electronics Technology (ISSE). Conference proceedings (International Spring Seminar on Electronics Technology). IEEE, 2019. p. 1-5. ISSN: 2161-2528.
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  ZVONEK, M.; ŠIRJOVOVÁ, V.; BRÁNECKÝ, M.; PLICHTA, T.; SKÁCEL, J.; ČECH, V. Plasma nanocoatings developed to control the shear strength of polymer composites. Polymers, 2019, vol. 11, no. 7, p. 1-16. ISSN: 2073-4360.
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  OTÁHAL, A.; SKÁCEL, J.; SZENDIUCH, I. Influence of Electric Current at Solidification of Solder. In 42nd International Spring Seminar on Electronics Technology (ISSE). Conference proceedings (International Spring Seminar on Electronics Technology). IEEE, 2019. p. 1-5. ISSN: 2161-2528.
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  ADÁMEK, M.; MLČEK, J.; ADÁMKOVÁ, A.; BORKOVCOVÁ, M.; BEDNÁŘOVÁ, M.; MUSILOVÁ, Z.; SKÁCEL, J.; SOCHOR, J.; FAMĚRA, O. Unusual aspects of the fat content of mealworm larvae as a novel food. Potravinarstvo Slovak Journal of Food Sciences, 2019, vol. 13, no. 1, p. 157-162. ISSN: 1337-0960.
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• 2018

  SKÁCEL, J.; SZENDIUCH, I.; OTÁHAL, A.; HEJÁTKOVÁ, E. X-ray Inspection of Ceramic Structures. In 2018 41st International Spring Seminar on Electronics Technology. Conference proceedings (International Spring Seminar on Electronics Technology). Zlatibor, Serbia: IEEE Computer Society, 2018. no. 1, p. 254-257. ISSN: 2161-2536.
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  SZENDIUCH, I.; HEJÁTKOVÁ, E.; HURBAN, M.; SKÁCEL, J. Eco-label and Self Environmental Claims in Electronics. In 2018 41st International Spring Seminar on Electronics Technology (ISSE 2018). Conference proceedings (International Spring Seminar on Electronics Technology). Institute of Electrical andElectronics Engineering (IEEE). Zlatibor, Serbia: IEEE Computer Society, 2018. no. 1, p. 251-256. ISBN: 9781538657300. ISSN: 2161-2536.
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  SKÁCEL, J.; SZENDIUCH, I.; OTÁHAL, A. Creation of Cavities in High-temperature Ceramics. In 2018 41st International Spring Seminar on Electronics Technology. Conference proceedings (International Spring Seminar on Electronics Technology). Zlatibor, Serbia: IEEE Computer Society, 2018. no. 1, p. 249-254. ISSN: 2161-2536.
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• 2017

  MLČEK, J.; ADÁMEK, M.; ADÁMKOVÁ, A.; BORKOVCOVÁ, M.; BEDNÁŘOVÁ, M.; SKÁCEL, J. Detection of selected heavy metals and micronutrients in edible insect and their dependency on the feed using XRF spectrometry. Potravinarstvo Slovak Journal of Food Sciences, 2017, vol. 11, no. 1, p. 725-730. ISSN: 1337-0960.
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  SKÁCEL, J.; SZENDIUCH, I.; NOVOTNÝ, V.; ŠANDERA, J. The analysis of reliability of solder joints on SMD ceramic resistor arrays. In Electronics Technology (ISSE), 2017 40th International Spring Seminar. Conference proceedings (International Spring Seminar on Electronics Technology). Volume 2017-September. Sofia, Bulgaria: IEEE Computer Society, 2017. no. 1, p. 240-245. ISBN: 978-1-5386-0582-0. ISSN: 2161-2528.
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  SKÁCEL, J.; SZENDIUCH, I. Three ways to ceramic packages. In Electronics Technology (ISSE), 2017 40th International Spring Seminar on. Conference proceedings (International Spring Seminar on Electronics Technology). Volume 2017-September. Sofia, Bulgaria: IEEE Computer Society, 2017. no. 1, p. 249-254. ISBN: 978-1-5386-0582-0. ISSN: 2161-2536.
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  ADÁMKOVÁ, A.; ADÁMEK, M.; MLČEK, J.; BORKOVCOVÁ, M.; BEDNÁŘOVÁ, M.; KOUŘIMSKÁ, L.; SKÁCEL, J.; VÍTOVÁ, E. Welfare of the Mealworm (Tenebrio molitor) Breeding With Regard to Nutrition Value and Food Safety. Potravinarstvo Slovak Journal of Food Sciences, 2017, vol. 11, no. 1, p. 460-465. ISSN: 1337-0960.
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  SKÁCEL, J.; SZENDIUCH, I. PREDICTION OF THE THICK FILM RESISTOR TRIMMING. In Sborník IMAPS flash Conference 2017. ElectroScope - http://www.electroscope.zcu.cz. 2017. no. 3, p. 19-22. ISBN: 978-80-214-5419-4. ISSN: 1802-4564.
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  ADÁMEK, M.; ADÁMKOVÁ, A.; BORKOVCOVÁ, M.; MLČEK, J.; BEDNÁŘOVÁ, M.; KOUŘIMSKÁ, L.; SKÁCEL, J.; ŘEZNÍČEK, M. Electronic Nose In Edible Insects Area. Potravinarstvo Slovak Journal of Food Sciences, 2017, vol. 11, no. 1, p. 446-451. ISSN: 1337-0960.
  Detail

  SKÁCEL, J. The technology of ceramic packages. In Proceedings of the 21st Conference STUDENT EEICT 2017. Brno: Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních, 2017. s. 542-546. ISBN: 978-80-214-5496-5.
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• 2016

  NOVOTNÝ, V.; ADÁMEK, M.; SKÁCEL, J.; ŠANDERA, J.; VALA, R. The Mechanical Strength of Solder Joints on PCB with OSP surface protection. In Proceedings of the International Spring Seminar on Electronics Technology, 39th International Spring Seminar on Electronics Technology, ISSE 2016. Conference proceedings (International Spring Seminar on Electronics Technology). Volume 2016-September. Pilsen, Czech republic: IEEE, 345 E 47TH ST, NEW YORK, NY 10017 USA, 2016. no. 1, p. 249-253. ISBN: 978-1-5090-1389-0. ISSN: 2161-2536.
  Detail

  SKÁCEL, J.; OTÁHAL, A.; SZENDIUCH, I. Sensitive Analysis of IR Heat Emitter for Soldering. In Proceedings of the 22nd Conference STUDENT EEICT 2016. Brno: Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií, 2016. p. 655-659. ISBN: 978-80-214-5350-0.
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  SKÁCEL, J.; OTÁHAL, A.; ŘIHÁK, P.; SZENDIUCH, I. The Quality of BGA Solder Joint with Underfill. In Sborník IMAPS flash Conference 2016. ElectroScope - http://www.electroscope.zcu.cz. 2016. no. 3, p. 19-22. ISBN: 978-80-214-5419-4. ISSN: 1802-4564.
  Detail

  SKÁCEL, J.; OTÁHAL, A.; SZENDIUCH, I. Designing of infrared heater with homogenous heat transfer. In Proceedings of the International Spring Seminar on Electronics Technology, 39th International Spring Seminar on Electronics Technology, ISSE 2016. Conference proceedings (International Spring Seminar on Electronics Technology). Volume 2016-September. Pilsen, Czech Republic: IEEE, 345 E 47TH ST, NEW YORK, NY 10017 USA, 2016. no. 1, p. 62-65. ISBN: 978-1-5090-1389-0. ISSN: 2161-2536.
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  NOVOTNÝ, V.; SKÁCEL, J.; ŠANDERA, J. The analysis of SMD resistor arrays soldered by Sn96 Ag3,5 Cu 0,5 and Sn42 Bi57.6 Ag0.4 in surface mount assembly. 2nd IMAPS Flash Conference 2016, Book of abstracts. 1. 2016. p. 56-57. ISBN: 978-80-214-5416-3.
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• 2015

  SZENDIUCH, I.; SOMER, J.; VALA, R.; ADÁMEK, M.; BURŠÍK, M.; HEJÁTKOVÁ, E.; OTÁHAL, A.; PSOTA, B.; ŘEZNÍČEK, M.; ŘIHÁK, P.; SKÁCEL, J. Moderní mikroelektronické technologie - základ elektronického hardware. 1. 1. Brno: Vysoké učení technické v Brně, FEKT, 2015. 188 s. ISBN: 978-80-214-5293-0.
  Detail

  SKÁCEL, J.; SZENDIUCH, I. THERMOMECHANICAL SIMULATION OF MODERN ELECTRONIC PACKAGES. In Proceedings of the 21st Conference STUDENT EEICT 2015. Brno: Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních, 2015. s. 289-291. ISBN: 978-80-214-5148-3.
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  SKÁCEL, J.; PSOTA, B.; SZENDIUCH, I. COMPARISON OF QFN AND BGA CHARACTERISTICS. In IMAPS FLASH CONFERENCE 2015. 1. BRNO: Vysoké účení technické v Brně, 2015. p. 25-26. ISBN: 978-80-214-5270-1.
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