Detail publikačního výsledku

Three ways to ceramic packages

SKÁCEL, J.; SZENDIUCH, I.

Originální název

Three ways to ceramic packages

Anglický název

Three ways to ceramic packages

Druh

Stať ve sborníku v databázi WoS či Scopus

Originální abstrakt

This paper is focused on ceramic packaging primarily on the technology of creation. The first part is about ceramic packages and aluminium oxide in general. This paper shows three technologies of ceramic package creation. The first one is ceramic powder pressing. The second one is high temperature co-fired ceramic. The third one is ceramic mold casting. The paper describes issues of creation and shows inspection with a figure from scanning electron microscope. The last part is focused on thick film printing and finalization of the ceramic package.

Anglický abstrakt

This paper is focused on ceramic packaging primarily on the technology of creation. The first part is about ceramic packages and aluminium oxide in general. This paper shows three technologies of ceramic package creation. The first one is ceramic powder pressing. The second one is high temperature co-fired ceramic. The third one is ceramic mold casting. The paper describes issues of creation and shows inspection with a figure from scanning electron microscope. The last part is focused on thick film printing and finalization of the ceramic package.

Klíčová slova

Ceramics, Powders, Aluminum oxide, Pressing

Klíčová slova v angličtině

Ceramics, Powders, Aluminum oxide, Pressing

Autoři

SKÁCEL, J.; SZENDIUCH, I.

Rok RIV

2018

Vydáno

08.08.2017

Nakladatel

IEEE Computer Society

Místo

Sofia, Bulgaria

ISBN

978-1-5386-0582-0

Kniha

Electronics Technology (ISSE), 2017 40th International Spring Seminar on

Edice

Volume 2017-September

ISSN

2161-2536

Periodikum

Conference proceedings (International Spring Seminar on Electronics Technology)

Svazek

1

Číslo

1

Stát

Spojené státy americké

Strany od

249

Strany do

254

Strany počet

4

URL

BibTex

@inproceedings{BUT138532,
  author="Josef {Skácel} and Ivan {Szendiuch}",
  title="Three ways to ceramic packages",
  booktitle="Electronics Technology (ISSE), 2017 40th International Spring Seminar on",
  year="2017",
  series="Volume 2017-September",
  journal="Conference proceedings (International Spring Seminar on Electronics Technology)",
  volume="1",
  number="1",
  pages="249--254",
  publisher="IEEE Computer Society",
  address="Sofia, Bulgaria",
  doi="10.1109/ISSE.2017.8000919",
  isbn="978-1-5386-0582-0",
  url="http://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=8000919"
}