Detail publikačního výsledku

Evaluation of Influence of Flux Residues After Rework and Repair Process of Underfilled BGA Packages

OTÁHAL, A.; ŘEZNÍČEK, M.; SKÁCEL, J.

Originální název

Evaluation of Influence of Flux Residues After Rework and Repair Process of Underfilled BGA Packages

Anglický název

Evaluation of Influence of Flux Residues After Rework and Repair Process of Underfilled BGA Packages

Druh

Stať ve sborníku v databázi WoS či Scopus

Originální abstrakt

This paper is focused on evaluation of influence of flux residues encapsulated under underfill of BGA package on failure, area size and circularity of solder balls interconnection after rework and repair process. The main goal of the work was to find out whether there will be a larger number of failures for washed or unwashed underfilled BGA packages after second reflow soldering process. Repeated cycle of reflow soldering simulated rework and repair process heat stress for neighboring devices with underfill. Results of this investigation were number of failures and failure modes of solder joints of BGA package.

Anglický abstrakt

This paper is focused on evaluation of influence of flux residues encapsulated under underfill of BGA package on failure, area size and circularity of solder balls interconnection after rework and repair process. The main goal of the work was to find out whether there will be a larger number of failures for washed or unwashed underfilled BGA packages after second reflow soldering process. Repeated cycle of reflow soldering simulated rework and repair process heat stress for neighboring devices with underfill. Results of this investigation were number of failures and failure modes of solder joints of BGA package.

Klíčová slova

ball grid arrays, circuit reliability, reflow soldering, soldering, solders, thermal stresses, tin alloys

Klíčová slova v angličtině

ball grid arrays, circuit reliability, reflow soldering, soldering, solders, thermal stresses, tin alloys

Autoři

OTÁHAL, A.; ŘEZNÍČEK, M.; SKÁCEL, J.

Rok RIV

2022

Vydáno

01.07.2021

Nakladatel

IEEE

ISBN

978-1-6654-1477-7

Kniha

2021 44th International Spring Seminar on Electronics Technology (ISSE)

ISSN

2161-2536

Periodikum

Conference proceedings (International Spring Seminar on Electronics Technology)

Svazek

44

Číslo

1

Stát

Spojené státy americké

Strany od

1

Strany do

4

Strany počet

4

URL

https://ieeexplore.ieee.org/document/9467519

BibTex

@inproceedings{BUT172557,
  author="Alexandr {Otáhal} and Michal {Řezníček} and Josef {Skácel}",
  title="Evaluation of Influence of Flux Residues After Rework and Repair Process of Underfilled BGA Packages",
  booktitle="2021 44th International Spring Seminar on Electronics Technology (ISSE)",
  year="2021",
  journal="Conference proceedings (International Spring Seminar on Electronics Technology)",
  volume="44",
  number="1",
  pages="1--4",
  publisher="IEEE",
  doi="10.1109/ISSE51996.2021.9467519",
  isbn="978-1-6654-1477-7",
  url="https://ieeexplore.ieee.org/document/9467519"
}