Detail publikačního výsledku

The Quality of BGA Solder Joint with Underfill

SKÁCEL, J.; OTÁHAL, A.; ŘIHÁK, P.; SZENDIUCH, I.

Originální název

The Quality of BGA Solder Joint with Underfill

Anglický název

The Quality of BGA Solder Joint with Underfill

Druh

Stať ve sborníku v databázi WoS či Scopus

Originální abstrakt

This paper deals with investigation of mechanical behavior (shear strength) of soldered BGA package with and without underfill on FR4 and Al2O3 carriers. BGA soldered on FR4 (ENIG) had higher value of shear strength than BGA soldered on alumina substrate with conductive thick film layer. Results was used for validation of virtual model and simulation in ANSYS Workbench. This simulation will be used for prediction of thermomechanical behavior of BGA packages soldered on alumina substrates and on organic substrates FR4.

Anglický abstrakt

This paper deals with investigation of mechanical behavior (shear strength) of soldered BGA package with and without underfill on FR4 and Al2O3 carriers. BGA soldered on FR4 (ENIG) had higher value of shear strength than BGA soldered on alumina substrate with conductive thick film layer. Results was used for validation of virtual model and simulation in ANSYS Workbench. This simulation will be used for prediction of thermomechanical behavior of BGA packages soldered on alumina substrates and on organic substrates FR4.

Klíčová slova

BGA, solder balls, underfill, reflow soldering

Klíčová slova v angličtině

BGA, solder balls, underfill, reflow soldering

Autoři

SKÁCEL, J.; OTÁHAL, A.; ŘIHÁK, P.; SZENDIUCH, I.

Rok RIV

2017

Vydáno

12.12.2016

ISBN

978-80-214-5419-4

Kniha

Sborník IMAPS flash Conference 2016

ISSN

1802-4564

Periodikum

ElectroScope - http://www.electroscope.zcu.cz

Svazek

2016

Číslo

3

Stát

Česká republika

Strany od

19

Strany do

22

Strany počet

36

BibTex

@inproceedings{BUT130695,
  author="Josef {Skácel} and Alexandr {Otáhal} and Pavel {Řihák} and Ivan {Szendiuch}",
  title="The Quality of BGA Solder Joint with Underfill",
  booktitle="Sborník IMAPS flash Conference 2016",
  year="2016",
  journal="ElectroScope - http://www.electroscope.zcu.cz",
  volume="2016",
  number="3",
  pages="19--22",
  isbn="978-80-214-5419-4",
  issn="1802-4564"
}