Přístupnostní navigace
E-přihláška
Vyhledávání Vyhledat Zavřít
Detail publikačního výsledku
OTÁHAL, A.; SKÁCEL, J.; SZENDIUCH, I.
Originální název
Influence of Electric Current at Solidification of Solder
Anglický název
Druh
Stať ve sborníku v databázi WoS či Scopus
Originální abstrakt
This paper deals with the possibility of affecting the creation of solder inner structure under the flow of electric current. The soldering apparatus with a special electrode system has been developed. The reflow of the solder occurred in a quartz glass tube where the brass electrodes were placed at each end of the tube. There have been tested two possibilities, with electric current and without current flow. The used inspection method was the optical inspection of micro-section cut with SEM microscopy.
Anglický abstrakt
Klíčová slova
scanning electron microscopy, soldering, solders solidification,
Klíčová slova v angličtině
Autoři
Rok RIV
2020
Vydáno
26.08.2019
Nakladatel
IEEE
Kniha
42nd International Spring Seminar on Electronics Technology (ISSE).
ISSN
2161-2528
Periodikum
Conference proceedings (International Spring Seminar on Electronics Technology)
Stát
Spojené státy americké
Strany od
1
Strany do
5
Strany počet
URL
https://ieeexplore.ieee.org/document/8810308
BibTex
@inproceedings{BUT161228, author="Alexandr {Otáhal} and Josef {Skácel} and Ivan {Szendiuch}", title="Influence of Electric Current at Solidification of Solder", booktitle="42nd International Spring Seminar on Electronics Technology (ISSE).", year="2019", journal="Conference proceedings (International Spring Seminar on Electronics Technology)", pages="1--5", publisher="IEEE", doi="10.1109/ISSE.2019.8810308", issn="2161-2528", url="https://ieeexplore.ieee.org/document/8810308" }