Detail publikačního výsledku

Wire-Bonds Durability in High-Temperature Applications

KLÍMA, M.; PSOTA, B.; SZENDIUCH, I.

Originální název

Wire-Bonds Durability in High-Temperature Applications

Anglický název

Wire-Bonds Durability in High-Temperature Applications

Druh

Stať ve sborníku v databázi WoS či Scopus

Originální abstrakt

This work aims to determine the suitability of use of low-temperature co-fired ceramics (LTCC) and thick film technology in applications with semiconductors based on SiC and GaN, that have high operating temperature. The paper is mainly focused on the behaviour and reliability of wire-bonds, which is used for connection of the above-mentioned semiconducting devices with a circuit or a package. A test sample was designed for this purpose, which was subjected to thermal load. Subsequently, changes in the bonds resistivity are studied, together with their strength and any defects caused by the thermal load. Other properties, such as termomechanical stress of the material for different temperature profiles were simulated in the ANSYS software.

Anglický abstrakt

This work aims to determine the suitability of use of low-temperature co-fired ceramics (LTCC) and thick film technology in applications with semiconductors based on SiC and GaN, that have high operating temperature. The paper is mainly focused on the behaviour and reliability of wire-bonds, which is used for connection of the above-mentioned semiconducting devices with a circuit or a package. A test sample was designed for this purpose, which was subjected to thermal load. Subsequently, changes in the bonds resistivity are studied, together with their strength and any defects caused by the thermal load. Other properties, such as termomechanical stress of the material for different temperature profiles were simulated in the ANSYS software.

Klíčová slova

wire-bond, wire-bonding, gold, LTCC, low-temperature co-fired ceramic

Klíčová slova v angličtině

wire-bond, wire-bonding, gold, LTCC, low-temperature co-fired ceramic

Autoři

KLÍMA, M.; PSOTA, B.; SZENDIUCH, I.

Rok RIV

2014

Vydáno

26.06.2013

Nakladatel

VUT

Místo

Brno

ISBN

978-80-214-4754-7

Kniha

Electronic Devices and Systems - IMAPS CS International Conference 2013

Edice

first

Strany od

38

Strany do

43

Strany počet

6

BibTex

@inproceedings{BUT99660,
  author="Martin {Klíma} and Boleslav {Psota} and Ivan {Szendiuch}",
  title="Wire-Bonds Durability in High-Temperature Applications",
  booktitle="Electronic Devices and Systems - IMAPS CS International Conference 2013",
  year="2013",
  series="first",
  number="1",
  pages="38--43",
  publisher="VUT",
  address="Brno",
  isbn="978-80-214-4754-7"
}