Detail publikačního výsledku

The Increasing Importance of the Thermal Management for Modern Electronic Packages

PSOTA, B.; SZENDIUCH, I.

Originální název

The Increasing Importance of the Thermal Management for Modern Electronic Packages

Anglický název

The Increasing Importance of the Thermal Management for Modern Electronic Packages

Druh

Článek recenzovaný mimo WoS a Scopus

Originální abstrakt

This paper deals with the modification of the thermal management for the modern types of the electronic packages. There is emphasized influence of the package mounting and additional adjustments of the PCB on the final thermal properties of the system. The results are gained through the computer simulation in the ANSYS software.

Anglický abstrakt

This paper deals with the modification of the thermal management for the modern types of the electronic packages. There is emphasized influence of the package mounting and additional adjustments of the PCB on the final thermal properties of the system. The results are gained through the computer simulation in the ANSYS software.

Klíčová slova

Thermal management, Electronic package, Simulation, ANSYS

Klíčová slova v angličtině

Thermal management, Electronic package, Simulation, ANSYS

Autoři

PSOTA, B.; SZENDIUCH, I.

Rok RIV

2013

Vydáno

31.12.2012

Nakladatel

Fakulta Elektrotechnická ZČU v Plzni

Místo

Plzeň

ISSN

1802-4564

Periodikum

ElectroScope - http://www.electroscope.zcu.cz

Svazek

2012

Číslo

VI.

Stát

Česká republika

Strany od

1

Strany do

5

Strany počet

5

BibTex

@article{BUT96451,
  author="Boleslav {Psota} and Ivan {Szendiuch}",
  title="The Increasing Importance of the Thermal Management for Modern Electronic Packages",
  journal="ElectroScope - http://www.electroscope.zcu.cz",
  year="2012",
  volume="2012",
  number="VI.",
  pages="1--5",
  issn="1802-4564"
}