Detail publikačního výsledku

Mechanical Stress of Chip SMD Components with Ceramic Body

ŠANDERA, J., HEJÁTKOVÁ, E.

Originální název

Mechanical Stress of Chip SMD Components with Ceramic Body

Anglický název

Mechanical Stress of Chip SMD Components with Ceramic Body

Druh

Stať ve sborníku v databázi WoS či Scopus

Originální abstrakt

The reasons of thermomechanical stress SMD ceramic capacitor soldered on FR4 material are described in this paper. Simulation ANSYS program for FEM analyse is used.

Anglický abstrakt

The reasons of thermomechanical stress SMD ceramic capacitor soldered on FR4 material are described in this paper. Simulation ANSYS program for FEM analyse is used.

Klíčová slova v angličtině

chip ceramic capacitor, package 1206, CTE, ANSYS software

Autoři

ŠANDERA, J., HEJÁTKOVÁ, E.

Vydáno

20.09.2003

Místo

Brno, University of Technology

ISBN

80-214-2452-4

Kniha

Electronic Devices and Systems

Strany od

398

Strany počet

5

BibTex

@inproceedings{BUT9561,
  author="Josef {Šandera} and Edita {Hejátková}",
  title="Mechanical Stress of Chip SMD Components with Ceramic Body",
  booktitle="Electronic Devices and Systems",
  year="2003",
  pages="5",
  address="Brno, University of Technology",
  isbn="80-214-2452-4"
}