Detail publikačního výsledku

Šandera, Finite Element Based Solder Joint Fatigue Life Predictions for Same Stacked FR4 and Ceramic Substrate

ŠANDERA, J.

Originální název

Šandera, Finite Element Based Solder Joint Fatigue Life Predictions for Same Stacked FR4 and Ceramic Substrate

Anglický název

Šandera, Finite Element Based Solder Joint Fatigue Life Predictions for Same Stacked FR4 and Ceramic Substrate

Druh

Stať ve sborníku v databázi WoS či Scopus

Originální abstrakt

This study explores the thermomechanical stresses of solder joint and solder joint fatigue life predictions calculated by finite elemement software ANSYS

Anglický abstrakt

This study explores the thermomechanical stresses of solder joint and solder joint fatigue life predictions calculated by finite elemement software ANSYS

Klíčová slova v angličtině

Interconnection failure, FEM, Thermomechanical stress, Darveaux s methodology, the viscoplastic strain energy density, stacked structure FR4-ceramic,power cycling procedure

Autoři

ŠANDERA, J.

Vydáno

20.09.2003

Nakladatel

Brno University of Technology

Místo

Brno University of Technology

ISBN

80-214-2452-4

Kniha

Electronic Devices and Systems 2003 - Proceedins

Edice

Brno University of Technology

Strany od

394

Strany počet

4

BibTex

@inproceedings{BUT9412,
  author="Josef {Šandera}",
  title="Šandera, Finite Element Based Solder Joint Fatigue Life Predictions for Same Stacked FR4 and Ceramic Substrate",
  booktitle="Electronic Devices and Systems 2003 - Proceedins",
  year="2003",
  series="Brno University of Technology",
  pages="4",
  publisher="Brno University of Technology",
  address="Brno University of Technology",
  isbn="80-214-2452-4"
}