Detail publikačního výsledku

Lead-free Soldering - when will be comming?

SZENDIUCH, I.

Originální název

Lead-free Soldering - when will be comming?

Anglický název

Lead-free Soldering - when will be comming?

Druh

Stať ve sborníku v databázi WoS či Scopus

Originální abstrakt

The first supposed date for replacing of lead-solders was January 1, 2004. We all can see that the reality is still distant and nobody is sure that it will be actually announced year 2006. There is no current definition of lead-free in electronics industry. However based on environmental restrictions, manufacturer requirements and industrial practice, the amount of lead contained in a lead-free alloy should be less than 0.1%. A large number of lead-free solders have been developed and applications have been made for over 100 patents on various alloy compositions. Although not all these alloys are commercially available there is still a wide range to choose from. Unfortunately within this range of lead-free solders, there is no absolute drop-in replacement for tin-lead alloy. It other words there is no lead-free alloy with the same melting temperature, wetting, cost and strength properties.

Anglický abstrakt

The first supposed date for replacing of lead-solders was January 1, 2004. We all can see that the reality is still distant and nobody is sure that it will be actually announced year 2006. There is no current definition of lead-free in electronics industry. However based on environmental restrictions, manufacturer requirements and industrial practice, the amount of lead contained in a lead-free alloy should be less than 0.1%. A large number of lead-free solders have been developed and applications have been made for over 100 patents on various alloy compositions. Although not all these alloys are commercially available there is still a wide range to choose from. Unfortunately within this range of lead-free solders, there is no absolute drop-in replacement for tin-lead alloy. It other words there is no lead-free alloy with the same melting temperature, wetting, cost and strength properties.

Klíčová slova

Solder-Free, Soldering, Factors, Parameters

Klíčová slova v angličtině

Solder-Free, Soldering, Factors, Parameters

Autoři

SZENDIUCH, I.

Vydáno

25.09.2003

Nakladatel

Technological Institute of Crete

Místo

Crete, Greece

ISBN

80-214-2461-3

Kniha

Proceedings of the Socrates Workshop 2003

Svazek

2003

Strany od

61

Strany počet

5

BibTex

@inproceedings{BUT9233,
  author="Ivan {Szendiuch}",
  title="Lead-free Soldering - when will be comming?",
  booktitle="Proceedings of the Socrates Workshop 2003",
  year="2003",
  volume="2003",
  pages="5",
  publisher="Technological Institute of Crete",
  address="Crete, Greece",
  isbn="80-214-2461-3"
}