Detail publikačního výsledku

Hardware for Physics - on failure Based Accelerated Stress Testing of Solder Joint

HUB, P., ŠANDERA, J.

Originální název

Hardware for Physics - on failure Based Accelerated Stress Testing of Solder Joint

Anglický název

Hardware for Physics - on failure Based Accelerated Stress Testing of Solder Joint

Druh

Stať ve sborníku v databázi WoS či Scopus

Originální abstrakt

This article describes advanced thermomechanical accelerated testing technique of solder joint reliability.

Anglický abstrakt

This article describes advanced thermomechanical accelerated testing technique of solder joint reliability.

Klíčová slova

accelerated testing, thermomechanical tests, solder joint, heating element, cooling water, thermal cycle, camera, timer, temperature capacity, thermocouple, temperature profil

Klíčová slova v angličtině

accelerated testing, thermomechanical tests, solder joint, heating element, cooling water, thermal cycle, camera, timer, temperature capacity, thermocouple, temperature profil

Autoři

HUB, P., ŠANDERA, J.

Vydáno

09.09.2003

Nakladatel

Vysoké učení technické v Brně, Antonínská 1

Místo

Brno

ISBN

80-214-2452-4

Kniha

10th Electronic Devices and Systems Conference 2003

Svazek

2003

Číslo

1

Strany od

489

Strany počet

4

BibTex

@inproceedings{BUT9231,
  author="Petr {Hub} and Josef {Šandera}",
  title="Hardware for Physics - on failure Based Accelerated Stress Testing of Solder Joint",
  booktitle="10th Electronic Devices and Systems Conference 2003",
  year="2003",
  volume="2003",
  number="1",
  pages="4",
  publisher="Vysoké učení technické v Brně, Antonínská 1",
  address="Brno",
  isbn="80-214-2452-4"
}