Detail publikačního výsledku

Roadmap of Thermal Management Structure

BULVA, J.

Originální název

Roadmap of Thermal Management Structure

Anglický název

Roadmap of Thermal Management Structure

Druh

Stať ve sborníku v databázi WoS či Scopus

Originální abstrakt

This paper focuses on the thermal management application for modern microelectronics systems. The aim is to describe basic physical principles of the heat transfer and thermal resistance. Simplified equations for the heat transfer within electronic components are introduced and a variety of cooling methods is also discussed.

Anglický abstrakt

This paper focuses on the thermal management application for modern microelectronics systems. The aim is to describe basic physical principles of the heat transfer and thermal resistance. Simplified equations for the heat transfer within electronic components are introduced and a variety of cooling methods is also discussed.

Klíčová slova v angličtině

thermal management, conduction, convection, radiation

Autoři

BULVA, J.

Vydáno

24.04.2003

Nakladatel

Ing. Zdeněk Novotný CSc, Ondráčkova 70a, Brno

Místo

Brno

ISBN

80-214-2379-X

Kniha

Proceedings of 9th Conference and Competition STUDENT EEICT 2003 Volume 3

Strany od

412

Strany počet

5

BibTex

@inproceedings{BUT7629,
  author="Jindřich {Bulva}",
  title="Roadmap of Thermal Management Structure",
  booktitle="Proceedings of 9th Conference and Competition STUDENT EEICT 2003 Volume 3",
  year="2003",
  number="1",
  pages="5",
  publisher="Ing. Zdeněk Novotný CSc, Ondráčkova 70a, Brno",
  address="Brno",
  isbn="80-214-2379-X"
}