Detail publikačního výsledku

3D LTCC and Flexible Structure Interconnections Based on Galvanized Layers

NICÁK, M.; ŠANDERA, J.

Originální název

3D LTCC and Flexible Structure Interconnections Based on Galvanized Layers

Anglický název

3D LTCC and Flexible Structure Interconnections Based on Galvanized Layers

Druh

Stať ve sborníku v databázi WoS či Scopus

Originální abstrakt

Interconnections have an important role in packaging as they not only provide electrical connection but they also act as mechanical attachment between connected substrates and are supposed to be as reliable as possible. This paper describes design, construction and some recent laboratory tests of 3D stacked structures, where different materials with different coefficient of thermal expansion are combined together in one package. Goal of this work is to develop reliable 3D stacked structure intercronnection method, which will allow connection between LTCC, Al2O3 and also flexible substrates.

Anglický abstrakt

Interconnections have an important role in packaging as they not only provide electrical connection but they also act as mechanical attachment between connected substrates and are supposed to be as reliable as possible. This paper describes design, construction and some recent laboratory tests of 3D stacked structures, where different materials with different coefficient of thermal expansion are combined together in one package. Goal of this work is to develop reliable 3D stacked structure intercronnection method, which will allow connection between LTCC, Al2O3 and also flexible substrates.

Klíčová slova

LTCC, 3D, interconnection, structure, packaging

Klíčová slova v angličtině

LTCC, 3D, interconnection, structure, packaging

Autoři

NICÁK, M.; ŠANDERA, J.

Rok RIV

2012

Vydáno

12.09.2011

Nakladatel

IMAPS-Europe

Místo

Brighton, UK

ISBN

978-0-9568086-0-8

Kniha

Proceedings of 18th European microelectronics packaging conference EMPC 2011

Strany od

358

Strany do

361

Strany počet

4

URL

http://ieeexplore.ieee.org/xpl/login.jsp?tp=&arnumber=6142406&url=http%3A%2F%2Fieeexplore.ieee.org%2Fxpls%2Fabs_all.jsp%3Farnumber%3D6142406

BibTex

@inproceedings{BUT73400,
  author="Michal {Nicák} and Josef {Šandera}",
  title="3D LTCC and Flexible Structure Interconnections Based on Galvanized Layers",
  booktitle="Proceedings of 18th European microelectronics packaging conference EMPC 2011",
  year="2011",
  pages="358--361",
  publisher="IMAPS-Europe",
  address="Brighton, UK",
  isbn="978-0-9568086-0-8",
  url="http://ieeexplore.ieee.org/xpl/login.jsp?tp=&arnumber=6142406&url=http%3A%2F%2Fieeexplore.ieee.org%2Fxpls%2Fabs_all.jsp%3Farnumber%3D6142406"
}