Detail publikačního výsledku

Microstructure of ultra-fine grained Cu by UHV SLEEM

MIKMEKOVÁ, Š.; HOVORKA, M.; MÜLLEROVÁ, I.; FRANK, L.; MAN, O.; PANTĚLEJEV, L.

Originální název

Microstructure of ultra-fine grained Cu by UHV SLEEM

Anglický název

Microstructure of ultra-fine grained Cu by UHV SLEEM

Druh

Abstrakt

Originální abstrakt

Ultra-fine grained (UFG) materials belong nowadays to front line areas of research in material sciences. The UFG structure can be obtained by means of the equal channel angular pressing (ECAP). We report on study of the grain structure in ECAPed copper using the cathode lens equipped ultrahigh vacuum scanning low energy electron microscope (UHV SLEEM). The grain contrast was found achieving its maximum at electron energies below about 30 eV where it exhibited dependence on electron energy specific for the grain orientation. The energy dependence of the slow electron reflectance seemed to be capable of serving as a fingerprint enabling determination of the crystalline orientation. The very low energy electron reflectance might become an alternative to the electron backscatter diffraction method owing to its high resolution and fast data acquisition.

Anglický abstrakt

Ultra-fine grained (UFG) materials belong nowadays to front line areas of research in material sciences. The UFG structure can be obtained by means of the equal channel angular pressing (ECAP). We report on study of the grain structure in ECAPed copper using the cathode lens equipped ultrahigh vacuum scanning low energy electron microscope (UHV SLEEM). The grain contrast was found achieving its maximum at electron energies below about 30 eV where it exhibited dependence on electron energy specific for the grain orientation. The energy dependence of the slow electron reflectance seemed to be capable of serving as a fingerprint enabling determination of the crystalline orientation. The very low energy electron reflectance might become an alternative to the electron backscatter diffraction method owing to its high resolution and fast data acquisition.

Klíčová slova

UHV SLEEM, EBSD, ultra-fine grained structure

Klíčová slova v angličtině

UHV SLEEM, EBSD, ultra-fine grained structure

Autoři

MIKMEKOVÁ, Š.; HOVORKA, M.; MÜLLEROVÁ, I.; FRANK, L.; MAN, O.; PANTĚLEJEV, L.

Rok RIV

2010

Vydáno

30.08.2009

Nakladatel

Verlag der TU Gratz

Místo

Gratz

ISBN

978-3-85125-062-6

Kniha

MC 2009 GRATZ

Edice

Materials Science

Strany od

515

Strany do

516

Strany počet

2

BibTex

@misc{BUT60792,
  author="Šárka {Mikmeková} and Miloš {Hovorka} and Ilona {Müllerová} and Luděk {Frank} and Ondřej {Man} and Libor {Pantělejev}",
  title="Microstructure of ultra-fine grained Cu by UHV SLEEM",
  booktitle="MC 2009 GRATZ",
  year="2009",
  series="Materials Science",
  edition="1",
  pages="515--516",
  publisher="Verlag der TU Gratz",
  address="Gratz",
  isbn="978-3-85125-062-6",
  note="Abstract"
}