Detail publikačního výsledku

Influence of the CTE on Mechanical Stress of Chip SMD Components

ŠANDERA, J., HEJÁTKOVÁ, E.

Originální název

Influence of the CTE on Mechanical Stress of Chip SMD Components

Anglický název

Influence of the CTE on Mechanical Stress of Chip SMD Components

Druh

Stať ve sborníku v databázi WoS či Scopus

Originální abstrakt

This paper describes the reasons of mechanical stress of SMD chip components soldered on FR4 substrate caused by thermal changes on board. There is especially presented a simulation of mechanical stress in volume ceramic capacitor body in 1206 package. Simulation ANSYS program for finite element analysis and design is used.

Anglický abstrakt

This paper describes the reasons of mechanical stress of SMD chip components soldered on FR4 substrate caused by thermal changes on board. There is especially presented a simulation of mechanical stress in volume ceramic capacitor body in 1206 package. Simulation ANSYS program for finite element analysis and design is used.

Klíčová slova

SMT, Chip Component, Coefficient of Thermal Expansion, Effective Stress, ANSYS simulation software, 1206 chip component

Klíčová slova v angličtině

SMT, Chip Component, Coefficient of Thermal Expansion, Effective Stress, ANSYS simulation software, 1206 chip component

Autoři

ŠANDERA, J., HEJÁTKOVÁ, E.

Vydáno

01.01.2002

Místo

Brno

ISBN

80-214-2217-3

Kniha

Socrates Workshop 2002 - Proceedings

Strany od

92

Strany počet

5

BibTex

@inproceedings{BUT5119,
  author="Josef {Šandera} and Edita {Hejátková}",
  title="Influence of the CTE on Mechanical Stress of Chip SMD Components",
  booktitle="Socrates Workshop 2002 - Proceedings",
  year="2002",
  number="1.",
  pages="5",
  address="Brno",
  isbn="80-214-2217-3"
}