Detail publikace

A Novel Laboratory Anodic Bonding Device for MEMS Applications

HÁZE, J. VRBA, R. PAVLÍK, M. PEKÁREK, J.

Originální název

A Novel Laboratory Anodic Bonding Device for MEMS Applications

Typ

článek v časopise - ostatní, Jost

Jazyk

angličtina

Originální abstrakt

The article deals with a novel laboratory anodic bonding device. This device is used for MEMS creation. The anodic bonding is a method for joining glass with silicon. It is one of the important steps of MEMS components packaging. The bonding mechanism joins the glass and silicon by heating them above 400 C and by applying an external DC electric field in a range of 500 - 1000 V. The bonded region can be seen easily through the glass because it changes the color to gray. The measured bonding strength is over 15 MPa and the cracks occur on the glass, i.e. the bonding strength is over the mechanical strength of the glass.

Klíčová slova

anodic bonding, MEMS

Autoři

HÁZE, J.; VRBA, R.; PAVLÍK, M.; PEKÁREK, J.

Rok RIV

2010

Vydáno

7. 12. 2010

Nakladatel

ZCU Plzeň

Místo

Plzeň

ISSN

1802-4564

Periodikum

ElectroScope - http://www.electroscope.zcu.cz

Ročník

2010

Číslo

3

Stát

Česká republika

Strany od

24

Strany do

26

Strany počet

3

BibTex

@article{BUT50401,
  author="Jiří {Háze} and Radimír {Vrba} and Michal {Pavlík} and Jan {Pekárek}",
  title="A Novel Laboratory Anodic Bonding Device for MEMS Applications",
  journal="ElectroScope - http://www.electroscope.zcu.cz",
  year="2010",
  volume="2010",
  number="3",
  pages="24--26",
  issn="1802-4564"
}