Detail publikačního výsledku

New trends of BGA Soldering in education

ADÁMEK, M.; PRÁŠEK, J.; NICÁK, M.

Originální název

New trends of BGA Soldering in education

Anglický název

New trends of BGA Soldering in education

Druh

Článek recenzovaný mimo WoS a Scopus

Originální abstrakt

This paper deals with the problematic of modern soldering technologies and the implementation of new trends of modern soldering technologies into education process. It describes the possibilities of implementation of modern equipment in the education process, concretely in courses specialized to modern technologies of electronic circuits and systems. The possibilities of 3-D structures and BGA soldering using own prepared ceramic and organic based samples were presented. The samples with deposited solder paste using stencil printing techniques were assembled using Fritch microplacer and soldered using vapor phase soldering device Asscon Quicky 300. The final inspection of soldered joints was made using Ersascope special optical inspection device. Finally it was found that this process is suitable for practical education in the lessons of modern packaging and systems subjects.

Anglický abstrakt

This paper deals with the problematic of modern soldering technologies and the implementation of new trends of modern soldering technologies into education process. It describes the possibilities of implementation of modern equipment in the education process, concretely in courses specialized to modern technologies of electronic circuits and systems. The possibilities of 3-D structures and BGA soldering using own prepared ceramic and organic based samples were presented. The samples with deposited solder paste using stencil printing techniques were assembled using Fritch microplacer and soldered using vapor phase soldering device Asscon Quicky 300. The final inspection of soldered joints was made using Ersascope special optical inspection device. Finally it was found that this process is suitable for practical education in the lessons of modern packaging and systems subjects.

Klíčová slova

Education, BGA, Soldering, 3-D packaging

Klíčová slova v angličtině

Education, BGA, Soldering, 3-D packaging

Autoři

ADÁMEK, M.; PRÁŠEK, J.; NICÁK, M.

Rok RIV

2011

Vydáno

14.09.2009

Nakladatel

Technical University of Sofia

Místo

Sofia, Bulgaria

ISSN

1313-1842

Periodikum

Electronics

Svazek

3

Číslo

2

Stát

Bulharská republika

Strany od

26

Strany do

28

Strany počet

3

BibTex

@article{BUT48881,
  author="Martin {Adámek} and Jan {Prášek} and Michal {Nicák}",
  title="New trends of BGA Soldering in education",
  journal="Electronics",
  year="2009",
  volume="3",
  number="2",
  pages="26--28",
  issn="1313-1842"
}