Detail publikačního výsledku

Study of Thermal stability of Ultrafine-grained Copper by means of Electron Back Scattering Diffraction

MAN, O.; PANTĚLEJEV, L.; KUNZ, L.

Originální název

Study of Thermal stability of Ultrafine-grained Copper by means of Electron Back Scattering Diffraction

Anglický název

Study of Thermal stability of Ultrafine-grained Copper by means of Electron Back Scattering Diffraction

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Článek recenzovaný mimo WoS a Scopus

Originální abstrakt

Thermal stability of ultrafine-grained (UFG) structure of 99.9% pure copper produced by eight equal channel angular pressing (ECAP) passes was studied. The annealing experiments were conducted at 180degC in a tube furnace under argon as a covering gas. The dwell times were in the range of 10 min to 120 min. The electron backscattering diffraction (EBSD) analyses were performed before and after annealing at exactly the same area in order to quantify the degree of decomposition of the UFG structure. Definition of grain boundaries was based on the misorientation angle of 1. More advanced analysis of the EBSD results based on a kernel average misorientation (KAM) parameter was performed. Inverse pole figure maps with included grain networks did not reveal any substantial changes of UFG microstructure due to annealing. Some shift in the KAM modus in comparison with the initial state was observed but its magnitude was found negligible. Also changes in texture were found to be minor. On the other hand the microhardness increases with increasing time of annealing.

Anglický abstrakt

Thermal stability of ultrafine-grained (UFG) structure of 99.9% pure copper produced by eight equal channel angular pressing (ECAP) passes was studied. The annealing experiments were conducted at 180degC in a tube furnace under argon as a covering gas. The dwell times were in the range of 10 min to 120 min. The electron backscattering diffraction (EBSD) analyses were performed before and after annealing at exactly the same area in order to quantify the degree of decomposition of the UFG structure. Definition of grain boundaries was based on the misorientation angle of 1. More advanced analysis of the EBSD results based on a kernel average misorientation (KAM) parameter was performed. Inverse pole figure maps with included grain networks did not reveal any substantial changes of UFG microstructure due to annealing. Some shift in the KAM modus in comparison with the initial state was observed but its magnitude was found negligible. Also changes in texture were found to be minor. On the other hand the microhardness increases with increasing time of annealing.

Klíčová slova

ultra-fine grained copper, thermal stability of microstructure, EBSD, grain size, texture

Klíčová slova v angličtině

ultra-fine grained copper, thermal stability of microstructure, EBSD, grain size, texture

Autoři

MAN, O.; PANTĚLEJEV, L.; KUNZ, L.

Rok RIV

2011

Vydáno

25.01.2010

Nakladatel

The Japan Institute of Metals

Místo

Japonsko

ISSN

1345-9678

Periodikum

MATERIALS TRANSACTIONS

Svazek

51

Číslo

2

Stát

Japonsko

Strany od

209

Strany do

213

Strany počet

5

BibTex

@article{BUT48360,
  author="Ondřej {Man} and Libor {Pantělejev} and Ludvík {Kunz}",
  title="Study of Thermal stability of Ultrafine-grained Copper by means of Electron Back Scattering Diffraction",
  journal="MATERIALS TRANSACTIONS",
  year="2010",
  volume="51",
  number="2",
  pages="209--213",
  issn="1345-9678"
}