Detail publikačního výsledku

Material Compatibility and Process Optimization in Lead Free Soldering

STARÝ, J.

Originální název

Material Compatibility and Process Optimization in Lead Free Soldering

Anglický název

Material Compatibility and Process Optimization in Lead Free Soldering

Druh

Stať ve sborníku v databázi WoS či Scopus

Originální abstrakt

Lead Free Soldering and Material Compatibility are disscussed from the wettability point of view. Experimental part shortly describes method of the solder ball reflowing on different surfaces with different chemistry: Wettability results on different surfaces Cu, Au/Ni, Sn. are presented.

Anglický abstrakt

Lead Free Soldering and Material Compatibility are disscussed from the wettability point of view. Experimental part shortly describes method of the solder ball reflowing on different surfaces with different chemistry: Wettability results on different surfaces Cu, Au/Ni, Sn. are presented.

Klíčová slova v angličtině

lead-free, soldering, compatibility, wetting

Autoři

STARÝ, J.

Vydáno

30.11.2002

Místo

Brno

ISBN

80-214-2217-3

Kniha

Socrates Workshop 2002- Proceedings.Intensive Training Programme in Electronic System Design.

Strany od

200

Strany počet

5

BibTex

@inproceedings{BUT4276,
  author="Jiří {Starý}",
  title="Material Compatibility and Process Optimization in Lead Free Soldering",
  booktitle="Socrates Workshop 2002- Proceedings.Intensive Training Programme in Electronic System Design.",
  year="2002",
  pages="5",
  address="Brno",
  isbn="80-214-2217-3"
}