Detail publikačního výsledku

New Facts from Lead-free Solders Reliability Investigation

BURŠÍK, M.; SZENDIUCH, I.; JANKOVSKÝ, J.; HEJÁTKOVÁ, E.

Originální název

New Facts from Lead-free Solders Reliability Investigation

Anglický název

New Facts from Lead-free Solders Reliability Investigation

Druh

Stať ve sborníku v databázi WoS či Scopus

Originální abstrakt

The aim is to investigate some factors which influencing solder joint reliability and voids restriction, especially by reflow soldering process. The core factor for prediction and evaluation of solder joint reliability is solder joint structure.

Anglický abstrakt

The aim is to investigate some factors which influencing solder joint reliability and voids restriction, especially by reflow soldering process. The core factor for prediction and evaluation of solder joint reliability is solder joint structure.

Klíčová slova

Lead-free, reliability, solder, structure

Klíčová slova v angličtině

Lead-free, reliability, solder, structure

Autoři

BURŠÍK, M.; SZENDIUCH, I.; JANKOVSKÝ, J.; HEJÁTKOVÁ, E.

Rok RIV

2011

Vydáno

13.09.2010

Místo

Berlín, Německo

ISBN

978-1-4244-8555-0

Kniha

Electronics System Integration Technology Conference ESTC 2010 in Berlin

Edice

1

Strany od

101

Strany do

105

Strany počet

5

BibTex

@inproceedings{BUT35244,
  author="Martin {Buršík} and Ivan {Szendiuch} and Jaroslav {Jankovský} and Edita {Hejátková}",
  title="New Facts from Lead-free Solders Reliability Investigation",
  booktitle="Electronics System Integration Technology Conference ESTC 2010 in Berlin",
  year="2010",
  series="1",
  number="1",
  pages="101--105",
  address="Berlín, Německo",
  isbn="978-1-4244-8555-0"
}