Detail publikačního výsledku

Levné 3-D pouzdření a multimodulové struktury

ŠANDERA, J., HEJÁTKOVÁ, E.

Originální název

Levné 3-D pouzdření a multimodulové struktury

Anglický název

Cheap 3-D Packaging and Multimodule Structures

Druh

Stať ve sborníku v databázi WoS či Scopus

Originální abstrakt

Since development of integrated circuit it has been known, that drastically increases number of leads, because it's structure is more complicated. Finally 3-D (three- dimension) technique permits by passing barrier of 100% of the efficiency of packaging. The research of this problem and especially low cost solution, seems to be very interesting a significant.

Anglický abstrakt

Since development of integrated circuit it has been known, that drastically increases number of leads, because it's structure is more complicated. Finally 3-D (three- dimension) technique permits by passing barrier of 100% of the efficiency of packaging. The research of this problem and especially low cost solution, seems to be very interesting a significant.

Klíčová slova v angličtině

3-D structures, packaging efficiency, multimodule, ball-terminal, edge-terminal

Autoři

ŠANDERA, J., HEJÁTKOVÁ, E.

Vydáno

01.01.2001

Nakladatel

Ing. Zdeněk Novotný, CSc, Brno, Ondráčkova 105

Místo

Brno

ISBN

80-214-1960-1

Kniha

8th Electronic Devices and Systems Conference 2001

Strany od

199

Strany do

204

Strany počet

5

BibTex

@inproceedings{BUT3338,
  author="Josef {Šandera} and Edita {Hejátková}",
  title="Levné 3-D pouzdření a multimodulové struktury",
  booktitle="8th Electronic Devices and Systems Conference 2001",
  year="2001",
  pages="199--204",
  publisher="Ing. Zdeněk Novotný, CSc, Brno, Ondráčkova 105",
  address="Brno",
  isbn="80-214-1960-1"
}