Elimination of heat bridge in doorsill part

Elimination of heat bridge in doorsill part

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Load bearing door structure makes use of doorsill links with an inserted rubber band. The base element in most cases is extruded polystyrene or foam glass. In these solutions the produced boards are adjusted on the construction site. This impairs their thermal-technical and mechanical properties. The technological procedures necessary to ensure repeated function are both laborious and financially demanding. The solution offers "base structures for doorsill link" embedded in the floor structure. It is composed of minimum of two recycled plastic board. The design of the boards distributes dynamic load caused by operation in the bearing layers. The problem with termination of damp insulation is solved by pulling the damp insulation between the boards. Connection of the boards results in fixed and water impermeable termination of the insulation. Testing boards were formed of waste materials and heat dissipation coefficient was measured. Pressure load was further measured on long-term basis. From the discovered data it is possible to assess the susceptibility of the manufactured sample to creep.

Load bearing door structure makes use of doorsill links with an inserted rubber band. The base element in most cases is extruded polystyrene or foam glass. In these solutions the produced boards are adjusted on the construction site. This impairs their thermal-technical and mechanical properties. The technological procedures necessary to ensure repeated function are both laborious and financially demanding. The solution offers "base structures for doorsill link" embedded in the floor structure. It is composed of minimum of two recycled plastic board. The design of the boards distributes dynamic load caused by operation in the bearing layers. The problem with termination of damp insulation is solved by pulling the damp insulation between the boards. Connection of the boards results in fixed and water impermeable termination of the insulation. Testing boards were formed of waste materials and heat dissipation coefficient was measured. Pressure load was further measured on long-term basis. From the discovered data it is possible to assess the susceptibility of the manufactured sample to creep.

Elimination, heat bridge, doorsill

Elimination, heat bridge, doorsill

SMOLKA, R.; MATĚJKA, L.

2010

20.04.2009

Akademické nakladatelství CERM

Brno

978-80-7204-629-4

XII. MEZINÁRODNÍ V..DECKÁ KONFERENCE XIIth INTERNATIONAL SCIENTIFIC CONFERENCE

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