Detail publikačního výsledku

Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Interconnections

SZENDIUCH, I.; NOVOTNÝ, M.; BARTOŇ, Z.

Originální název

Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Interconnections

Anglický název

Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Interconnections

Druh

Stať ve sborníku v databázi WoS či Scopus

Originální abstrakt

study of wire bonding connection for power chips

Anglický abstrakt

study of wire bonding connection for power chips

Klíčová slova

wire bonding for high current

Klíčová slova v angličtině

wire bonding for high current

Autoři

SZENDIUCH, I.; NOVOTNÝ, M.; BARTOŇ, Z.

Vydáno

23.10.2007

Místo

Cairo

ISBN

978-1-4244-1824-4

Kniha

Proceedings IDT'07

Strany od

242

Strany do

245

Strany počet

4

BibTex

@inproceedings{BUT28219,
  author="Ivan {Szendiuch} and Marek {Novotný} and Zdeněk {Bartoň}",
  title="Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Measurement Environment for Reliability Study of High Current First Level Interconnections",
  booktitle="Proceedings IDT'07",
  year="2007",
  number="1",
  pages="242--245",
  address="Cairo",
  isbn="978-1-4244-1824-4"
}