Detail publikačního výsledku

Simulation of different substrates connection

Novotný, M., Szendiuch, I.

Originální název

Simulation of different substrates connection

Anglický název

Simulation of different substrates connection

Druh

Stať ve sborníku v databázi WoS či Scopus

Originální abstrakt

This paper describes recent developments made to the finite element modeling of substrates interconnection, extending its capability to handle viscoplastic behavior. It also presents the validation of this approach and results obtained for an interconnection of different substrates.

Anglický abstrakt

This paper describes recent developments made to the finite element modeling of substrates interconnection, extending its capability to handle viscoplastic behavior. It also presents the validation of this approach and results obtained for an interconnection of different substrates.

Klíčová slova v angličtině

Stress, interconnection, ANSYS

Autoři

Novotný, M., Szendiuch, I.

Vydáno

01.01.2006

Nakladatel

VUT Brno

Místo

Brno

ISBN

80-214-3246-2

Kniha

Proceedings EDS '06

Strany od

499

Strany počet

5

Plný text v Digitální knihovně

http://hdl.handle.net/

BibTex

@inproceedings{BUT24669,
  author="Marek {Novotný} and Ivan {Szendiuch}",
  title="Simulation of different substrates connection",
  booktitle="Proceedings EDS '06",
  year="2006",
  number="první",
  pages="5",
  publisher="VUT Brno",
  address="Brno",
  isbn="80-214-3246-2"
}