Detail publikačního výsledku

Realization and Simulation of Interconnection of Solar Cell

Jakubka,L., Novotny,M., Szendiuch,I.

Originální název

Realization and Simulation of Interconnection of Solar Cell

Anglický název

Realization and Simulation of Interconnection of Solar Cell

Druh

Stať ve sborníku v databázi WoS či Scopus

Originální abstrakt

This work is about interconnection of the solar cell and the substrate. Ceramic substrate and back side contact solar cells were used. The Ag paste was used as a conductive layer and lead free solder paste was chosen as a solder. 3 firing profiles in 4-zone furnace were tested. The thermal cycling is the next step. In the end of this work is the simulation in ANSYS.

Anglický abstrakt

This work is about interconnection of the solar cell and the substrate. Ceramic substrate and back side contact solar cells were used. The Ag paste was used as a conductive layer and lead free solder paste was chosen as a solder. 3 firing profiles in 4-zone furnace were tested. The thermal cycling is the next step. In the end of this work is the simulation in ANSYS.

Klíčová slova v angličtině

Interconnection, Back Side Contact Solar Cell, Reliability, ANSYS

Autoři

Jakubka,L., Novotny,M., Szendiuch,I.

Vydáno

01.01.2006

Nakladatel

Prof. Vítězslav Benda, PhD.

Místo

Praha

ISBN

80-01-03467-4

Kniha

3rd INTERNATIONAL WORKSHOP ON TEACHING IN PHOTOVOLTAIC, IWTPV´06 PROCEEDINGS

Strany od

119

Strany počet

4

BibTex

@inproceedings{BUT21051,
  author="Luboš {Jakubka} and Marek {Novotný} and Ivan {Szendiuch}",
  title="Realization and Simulation of Interconnection of Solar Cell",
  booktitle="3rd INTERNATIONAL WORKSHOP ON TEACHING IN PHOTOVOLTAIC, IWTPV´06 PROCEEDINGS",
  year="2006",
  number="první",
  pages="4",
  publisher="Prof. Vítězslav Benda, PhD.",
  address="Praha",
  isbn="80-01-03467-4"
}