Detail publikačního výsledku

Technological Integration and Challenges Faced by Electronic Industry

SZENDIUCH, I.

Originální název

Technological Integration and Challenges Faced by Electronic Industry

Anglický název

Technological Integration and Challenges Faced by Electronic Industry

Druh

Stať ve sborníku v databázi WoS či Scopus

Originální abstrakt

Publication deals with new approaches in the developments of modern electronics circuits, systems and equipments

Anglický abstrakt

Publication deals with new approaches in the developments of modern electronics circuits, systems and equipments

Klíčová slova

packaging, FCH, WLP, assembly and interconnection

Klíčová slova v angličtině

packaging, FCH, WLP, assembly and interconnection

Autoři

SZENDIUCH, I.

Vydáno

01.01.2000

Nakladatel

Ing. Zdeněk Novotný, CSc.

Místo

Brno

ISBN

80-214-1780-3

Kniha

Electronics Devices and Systems Y2K Proceedings.

Strany od

57

Strany do

62

Strany počet

9

BibTex

@inproceedings{BUT2038,
  author="Ivan {Szendiuch}",
  title="Technological Integration and Challenges Faced by Electronic Industry",
  booktitle="Electronics Devices and Systems Y2K Proceedings.",
  year="2000",
  pages="57--62",
  publisher="Ing. Zdeněk Novotný, CSc.",
  address="Brno",
  isbn="80-214-1780-3"
}