Detail publikačního výsledku

Interconnection of the back side contact solar cell and the ceramic substrate

Jakubka,L., Novotny,M., Szendiuch,I.

Originální název

Interconnection of the back side contact solar cell and the ceramic substrate

Anglický název

Interconnection of the back side contact solar cell and the ceramic substrate

Druh

Stať ve sborníku v databázi WoS či Scopus

Originální abstrakt

This work is about interconnection of the solar cell and the substrate. Ceramic substrate and back side contact solar cells were used. The Ag paste was used as a conductive layer and lead free solder paste was chosen as a solder. 3 firing profiles in 4-zone furnace were tested. The thermal cycling is the next step.

Anglický abstrakt

This work is about interconnection of the solar cell and the substrate. Ceramic substrate and back side contact solar cells were used. The Ag paste was used as a conductive layer and lead free solder paste was chosen as a solder. 3 firing profiles in 4-zone furnace were tested. The thermal cycling is the next step.

Klíčová slova v angličtině

Interconnection, Back Side Contact Solar Cell, Reliability

Autoři

Jakubka,L., Novotny,M., Szendiuch,I.

Vydáno

01.01.2006

Nakladatel

Darko Belavič

Místo

Ljubljana

ISBN

961-91023-4-7

Kniha

4th European Microelectronics and Packaging Symposium, EMPS 2006 Proceedings

Strany od

387

Strany počet

4

Plný text v Digitální knihovně

http://hdl.handle.net/

BibTex

@inproceedings{BUT18877,
  author="Luboš {Jakubka} and Marek {Novotný} and Ivan {Szendiuch}",
  title="Interconnection of the back side contact solar cell and the ceramic substrate",
  booktitle="4th European Microelectronics and Packaging Symposium, EMPS 2006 Proceedings",
  year="2006",
  number="první",
  pages="4",
  publisher="Darko Belavič",
  address="Ljubljana",
  isbn="961-91023-4-7"
}