Detail publikace

Effective Constitutive Parameters Retrieval of Artificial 3D Printed Dielectric Substrates with Conductive Inclusions

KADĚRA, P. LÁČÍK, J.

Originální název

Effective Constitutive Parameters Retrieval of Artificial 3D Printed Dielectric Substrates with Conductive Inclusions

Typ

článek ve sborníku ve WoS nebo Scopus

Jazyk

angličtina

Originální abstrakt

This paper presents an effective way of the effective constitutive parameters retrieval based on the multi-modal transfer matrix method of 3D printed dielectric substrates containing conductive inclusions. The periodic unit cell which supports self-supporting arrangement of conductive inclusion is investigated and the achieved results are compared to the eigenmode analysis in CST Studio Suite. The effect of various conductivity of metallic part on the effective relative permittivity and effective relative permeability is examined at a center frequency of 7 GHz. The obtained results are verified by transmission/reflection waveguide method.

Klíčová slova

Dielectric substrate; conductive inclusion; material characterization; additive manufacturing; 3D printing; modal analysis; waveguide

Autoři

KADĚRA, P.; LÁČÍK, J.

Vydáno

21. 4. 2022

Nakladatel

Institute of Electrical and Electronics Engineers

Místo

Kosice, Slovakia

ISBN

978-1-7281-8686-3

Kniha

Proceedings of the 2022 32th International Conference Radioelektronika (RADIOELEKTRONIKA)

Edice

1

Strany od

40

Strany do

43

Strany počet

4

URL

BibTex

@inproceedings{BUT177730,
  author="Petr {Kaděra} and Jaroslav {Láčík}",
  title="Effective Constitutive Parameters Retrieval of Artificial 3D Printed Dielectric Substrates with Conductive Inclusions",
  booktitle="Proceedings of the 2022 32th International Conference Radioelektronika (RADIOELEKTRONIKA)",
  year="2022",
  series="1",
  pages="40--43",
  publisher="Institute of Electrical and Electronics Engineers",
  address="Kosice, Slovakia",
  doi="10.1109/RADIOELEKTRONIKA54537.2022.9764946",
  isbn="978-1-7281-8686-3",
  url="https://ieeexplore.ieee.org/document/9764946"
}