Detail publikačního výsledku

Effect of Temperature Cycling on IMC Growth and Solder Joint Strength of SAC305 Solder Alloy and Low Silver Alloy REL61

DOKOUPIL, J.; STARÝ, J.

Originální název

Effect of Temperature Cycling on IMC Growth and Solder Joint Strength of SAC305 Solder Alloy and Low Silver Alloy REL61

Anglický název

Effect of Temperature Cycling on IMC Growth and Solder Joint Strength of SAC305 Solder Alloy and Low Silver Alloy REL61

Druh

Stať ve sborníku v databázi WoS či Scopus

Originální abstrakt

This work deals with the comparison of the standard SAC305 (Sn 96.5 %; Ag 3 %; Cu 0.5 %) solder alloy with melting temperature between 217 - 220 °C and an alternative alloy REL61 (SnBiAgCu) with lower silver content and melting temperature in the range of 208 - 215 °C in terms of IMC layer growth during thermal cycling and its effect on the shear strength of the solder joints. The test PCBs were soldered using two different temperature profiles and the temperature cycling was performed under two different conditions. No negative effect of REL61 solder alloy on the growth of the IMC layer under thermal stress and on the subsequent shear strength of the solder joint was found. From this point of view, the REL61 solder alloy can be used as a replacement for the SAC305 solder alloy.

Anglický abstrakt

This work deals with the comparison of the standard SAC305 (Sn 96.5 %; Ag 3 %; Cu 0.5 %) solder alloy with melting temperature between 217 - 220 °C and an alternative alloy REL61 (SnBiAgCu) with lower silver content and melting temperature in the range of 208 - 215 °C in terms of IMC layer growth during thermal cycling and its effect on the shear strength of the solder joints. The test PCBs were soldered using two different temperature profiles and the temperature cycling was performed under two different conditions. No negative effect of REL61 solder alloy on the growth of the IMC layer under thermal stress and on the subsequent shear strength of the solder joint was found. From this point of view, the REL61 solder alloy can be used as a replacement for the SAC305 solder alloy.

Klíčová slova

SAC305; REL61; IMC; temperature cycling; shear strength

Klíčová slova v angličtině

SAC305; REL61; IMC; temperature cycling; shear strength

Autoři

DOKOUPIL, J.; STARÝ, J.

Rok RIV

2022

Vydáno

08.12.2021

Nakladatel

ECS - The Electrochemical Society

Místo

Pennington, New Jersey 08534-2839, USA

Kniha

22nd International Conference Advanced Batteries, Accumulators and Fuel Cells

Edice

Volume 105

ISSN

1938-6737

Periodikum

ECS Transaction

Číslo

105

Stát

Spojené státy americké

Strany od

391

Strany do

400

Strany počet

10

BibTex

@inproceedings{BUT175426,
  author="Jakub {Dokoupil} and Jiří {Starý}",
  title="Effect of Temperature Cycling on IMC Growth and Solder Joint Strength of SAC305 Solder Alloy and Low Silver Alloy REL61",
  booktitle="22nd International Conference Advanced Batteries, Accumulators and Fuel Cells",
  year="2021",
  series="Volume 105",
  journal="ECS Transaction",
  number="105",
  pages="391--400",
  publisher="ECS - The Electrochemical Society",
  address="Pennington, New Jersey 08534-2839, USA",
  doi="10.1149/10501.0391ecst",
  issn="1938-6737"
}