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DALLAEV, R.
Originální název
Obtaining Thin Films Of Aln By Atomic Layer Deposition Using Nh3 Or N2h4 As Precursors
Anglický název
Druh
Konferenční sborník (ne stať)
Originální abstrakt
In this work we used atomic layer deposition (ALD) method to obtain thin films of AlN using tris(diethylamido)aluminum (III) (TDEAA) with hydrazine (N2H4) or ammonia (NH3) as precursors. Elemental analysis of the film deposited by ALD TDEAA /N2H4 at 200 °C showed the presence of carbon impurities ~ 1.4 at%, oxygen ~ 3.2 at.% and hydrogen 22.6 at.%. The atomic concentration ratio of N/Al was ~ 1.3. The residual impurities content with N2H4 was lower than with NH3. In general, it has been confirmed that hydrazine has a more preferable surface thermochemistry than ammonia.
Anglický abstrakt
Klíčová slova
atomic layer deposition, aluminum nitride, wide band-gap, thin films fabrication, semiconucting materials, hydrazine, ammonia, tris(diethylamido)aluminum
Klíčová slova v angličtině
Autoři
Rok RIV
2022
Vydáno
18.06.2018
ISBN
978-80-214-5614-3
Kniha
Proceedings of the 24th Conference STUDENT EEICT 2018
Strany počet
5
BibTex
@proceedings{BUT172599, editor="Rashid {Dallaev}", title="Obtaining Thin Films Of Aln By Atomic Layer Deposition Using Nh3 Or N2h4 As Precursors", year="2018", pages="5", isbn="978-80-214-5614-3" }