Detail publikace

Cooling of minimized surface-mount packages in power electronics applications

ŠÍR, M. FENO, I.

Originální název

Cooling of minimized surface-mount packages in power electronics applications

Typ

článek v časopise ve Web of Science, Jimp

Jazyk

angličtina

Originální abstrakt

With rise of GaN and SiC semiconductors in last few years, amount of available power semiconductors in minimized surface mount packages significantly increased. Together with rising pressure to increase power density of power conversion systems became effective design of cooling crucial. The aim of this article is to propose innovative methods of cooling of minimized surface mount packages, especially in application of power electronics. Article presents FEM thermal simulation of several possible variants of problem solution and provides results of measurement on physical prototypes with intention to compare. Results shows that the future of cooling in power electronics belongs to printed circuit boards with metal substrate.

Klíčová slova

power electronics, thermal vias, thermal management, surface mount package cooling, cooling of GaN

Autoři

ŠÍR, M.; FENO, I.

Vydáno

20. 8. 2020

Nakladatel

Przeglad Elektrotechniczny

Místo

Warsaw, Poland

ISSN

0033-2097

Periodikum

Przeglad Elektrotechniczny

Ročník

2020

Číslo

11

Stát

Polská republika

Strany od

151

Strany do

154

Strany počet

4

URL

http://pe.org.pl/index.php?lang=1

BibTex

@article{BUT164749,
  author="Michal {Šír} and Ivan {Feno}",
  title="Cooling of minimized surface-mount packages in power
electronics applications",
  journal="Przeglad Elektrotechniczny",
  year="2020",
  volume="2020",
  number="11",
  pages="151--154",
  doi="10.15199/48.2020.11.31",
  issn="0033-2097",
  url="http://pe.org.pl/index.php?lang=1"
}