Detail publikačního výsledku

Gas flow and heat transfer in reflow oven

SZENDIUCH, I.; HEJÁTKOVÁ, E.; HURBAN, M.

Originální název

Gas flow and heat transfer in reflow oven

Anglický název

Gas flow and heat transfer in reflow oven

Druh

Stať ve sborníku v databázi WoS či Scopus

Originální abstrakt

Soldering is very important technology to connect components and printed circuit boards together. Heat is transferred to soldering joint using flow of air or, generally, gas. Heat transfer is depending on more parameters, e.g. distance between product and nozzle field, strength of gas flow. It is very complex issue and not easy to measure. This paper describes some ideas, how to measure gas flow and heat transfer inside of an reflow oven.

Anglický abstrakt

Soldering is very important technology to connect components and printed circuit boards together. Heat is transferred to soldering joint using flow of air or, generally, gas. Heat transfer is depending on more parameters, e.g. distance between product and nozzle field, strength of gas flow. It is very complex issue and not easy to measure. This paper describes some ideas, how to measure gas flow and heat transfer inside of an reflow oven.

Klíčová slova

Reflow soldering, heat transfer coefficient, gas flow, 3D flow measuring.

Klíčová slova v angličtině

Reflow soldering, heat transfer coefficient, gas flow, 3D flow measuring.

Autoři

SZENDIUCH, I.; HEJÁTKOVÁ, E.; HURBAN, M.

Rok RIV

2019

Vydáno

08.08.2018

Nakladatel

IEEE Computer Society

Místo

Zlatibor, Serbia

Kniha

2018 41st International Spring Seminar on Electronics Technology

ISSN

2161-2536

Periodikum

Conference proceedings (International Spring Seminar on Electronics Technology)

Svazek

1

Číslo

1

Stát

Spojené státy americké

Strany od

254

Strany do

256

Strany počet

3

URL

http://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=8000919

BibTex

@inproceedings{BUT152057,
  author="Ivan {Szendiuch} and Edita {Hejátková} and Milan {Hurban}",
  title="Gas flow and heat transfer in reflow oven",
  booktitle="2018 41st International Spring Seminar on Electronics Technology",
  year="2018",
  journal="Conference proceedings (International Spring Seminar on Electronics Technology)",
  volume="1",
  number="1",
  pages="254--256",
  publisher="IEEE Computer Society",
  address="Zlatibor, Serbia",
  doi="10.1109/ISSE.2018.8443763",
  url="http://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=8000919"
}