Přístupnostní navigace
E-přihláška
Vyhledávání Vyhledat Zavřít
Detail publikačního výsledku
FILLNER, P.; HRDÝ, R.; PRÁŠEK, J.; NEŠPOR, D.; HUBÁLEK, J.
Originální název
ALD Grown Dielectrics for Cap on a Chip: Fabrication and Characterization
Anglický název
Druh
Stať ve sborníku v databázi WoS či Scopus
Originální abstrakt
Atomic layer deposition (ALD) is a strong method of fabrication of high-k dielectrics with excellent properties. We present the ALD grown high-k CMOS compatible dielectrics used for capacitors on a chip application. Several dielectric films based on Al2O3 and HfO2 were grown on high-conductive silicon wafers and used as on-chip circular capacitors with diameter from 100 to 1500 μm. The effect of the interface between dielectric layers was examined in oxide stuck-based films deposited by plasma-enhanced atomic layer deposition. Performed material, structural and electrical analyses of deposited dielectrics confirmed their highly promising properties for application in new generation of 3D capacitors, semiconductor devices and energy storage element.
Anglický abstrakt
Klíčová slova
ALD; high-k dielectric; hafnium; aluminum; capcacitor
Klíčová slova v angličtině
Autoři
Rok RIV
2019
Vydáno
21.08.2018
Nakladatel
IEEE Computer Society
Místo
Serbia
ISBN
9781538657317
Kniha
41st International Spring Seminar on Electronics Technology ISSE2018
ISSN
2161-2528
Periodikum
Conference proceedings (International Spring Seminar on Electronics Technology)
Svazek
2018
Stát
Spojené státy americké
Strany od
1
Strany do
5
Strany počet
BibTex
@inproceedings{BUT150785, author="Patrik {Fillner} and Radim {Hrdý} and Jan {Prášek} and Dušan {Nešpor} and Jaromír {Hubálek}", title="ALD Grown Dielectrics for Cap on a Chip: Fabrication and Characterization", booktitle="41st International Spring Seminar on Electronics Technology ISSE2018", year="2018", journal="Conference proceedings (International Spring Seminar on Electronics Technology)", volume="2018", pages="1--5", publisher="IEEE Computer Society", address="Serbia", doi="10.1109/ISSE.2018.8443766", isbn="9781538657317", issn="2161-2528" }