Detail publikačního výsledku

Innovative Methods for Through Holes Plating

OTÁHAL, A.; ŠIMEK, V.; CRHA, A.; RŮŽIČKA, R.; SZENDIUCH, I.

Originální název

Innovative Methods for Through Holes Plating

Anglický název

Innovative Methods for Through Holes Plating

Druh

Stať ve sborníku v databázi WoS či Scopus

Originální abstrakt

The main aim of this work was to investigate the influence of additional parameters in plating process of through-holes technology for PCBs. Vacuum, ultrasound and the combination of both was used during the activation process of hole´s surface. Therefore, research was focused on the activation process, which was revealed as the cause of plating problems. The samples used in this work were prepared with reverse pulse plating.

Anglický abstrakt

The main aim of this work was to investigate the influence of additional parameters in plating process of through-holes technology for PCBs. Vacuum, ultrasound and the combination of both was used during the activation process of hole´s surface. Therefore, research was focused on the activation process, which was revealed as the cause of plating problems. The samples used in this work were prepared with reverse pulse plating.

Klíčová slova

Copper plating, through-hole technology, printed circuit board, vacuum, ultrasound

Klíčová slova v angličtině

Copper plating, through-hole technology, printed circuit board, vacuum, ultrasound

Autoři

OTÁHAL, A.; ŠIMEK, V.; CRHA, A.; RŮŽIČKA, R.; SZENDIUCH, I.

Rok RIV

2017

Vydáno

18.05.2016

Nakladatel

University of West Bohemia

Místo

Pilsen, Czech Republic

ISBN

978-1-5090-1389-0

Kniha

2016 39th International Spring Seminar on Electronics Technology (ISSE)

ISSN

2161-2536

Periodikum

Conference proceedings (International Spring Seminar on Electronics Technology)

Stát

Spojené státy americké

Strany od

48

Strany do

52

Strany počet

534

BibTex

@inproceedings{BUT126050,
  author="Alexandr {Otáhal} and Václav {Šimek} and Adam {Crha} and Richard {Růžička} and Ivan {Szendiuch}",
  title="Innovative Methods for Through Holes Plating",
  booktitle="2016 39th International Spring Seminar on Electronics Technology (ISSE)",
  year="2016",
  journal="Conference proceedings (International Spring Seminar on Electronics Technology)",
  pages="48--52",
  publisher="University of West Bohemia",
  address="Pilsen, Czech Republic",
  doi="10.1109/ISSE.2016.7563159",
  isbn="978-1-5090-1389-0"
}