Detail publikačního výsledku

ENHANCED METHOD OF THROUGH-HOLE COPPER PLATING

OTÁHAL, A.; CRHA, A.; ŠIMEK, V.; RŮŽIČKA, R.; SZENDIUCH, I.

Originální název

ENHANCED METHOD OF THROUGH-HOLE COPPER PLATING

Anglický název

ENHANCED METHOD OF THROUGH-HOLE COPPER PLATING

Druh

Stať ve sborníku mimo WoS a Scopus

Originální abstrakt

This paper deals with optimizing of copper plating process for manufacturing of small-scale industries of printed circuit boards. Main discussed procedure in this paper is activation of printed circuit board surface for conformal copper plated surface of through holes. Innova-tive part of process was activating of holes surface with utilization of vacuum (lower pres-sure) and ultrasound. It helps reduce unplated edge of hole.

Anglický abstrakt

This paper deals with optimizing of copper plating process for manufacturing of small-scale industries of printed circuit boards. Main discussed procedure in this paper is activation of printed circuit board surface for conformal copper plated surface of through holes. Innova-tive part of process was activating of holes surface with utilization of vacuum (lower pres-sure) and ultrasound. It helps reduce unplated edge of hole.

Klíčová slova

Through-hole, reverse pulse plating, copper plating, PCB

Klíčová slova v angličtině

Through-hole, reverse pulse plating, copper plating, PCB

Autoři

OTÁHAL, A.; CRHA, A.; ŠIMEK, V.; RŮŽIČKA, R.; SZENDIUCH, I.

Rok RIV

2017

Vydáno

28.04.2016

Nakladatel

Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií

Místo

Brno

ISBN

978-80-214-5350-0

Kniha

Proceedings of the 22nd Conference STUDENT EEICT 2016

Strany od

610

Strany do

614

Strany počet

5

BibTex

@inproceedings{BUT124490,
  author="Alexandr {Otáhal} and Adam {Crha} and Václav {Šimek} and Richard {Růžička} and Ivan {Szendiuch}",
  title="ENHANCED METHOD OF THROUGH-HOLE COPPER PLATING",
  booktitle="Proceedings of the 22nd Conference STUDENT EEICT 2016",
  year="2016",
  pages="610--614",
  publisher="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií",
  address="Brno",
  isbn="978-80-214-5350-0"
}