Detail publikačního výsledku

Measurement Setup for Identifying Parameters of the Encapsulated Bond Wires

PETRŽELA, J.; ŠOTNER, R.; GÖTTHANS, T.; DŘÍNOVSKÝ, J.; KRATOCHVÍL, T.; WIEERS, A.

Originální název

Measurement Setup for Identifying Parameters of the Encapsulated Bond Wires

Anglický název

Measurement Setup for Identifying Parameters of the Encapsulated Bond Wires

Druh

Stať ve sborníku v databázi WoS či Scopus

Originální abstrakt

This short paper describes the experimental measurement setup for extraction of dynamical parameters of the encapsulated bond wires. Based on the proposed method a current carrying capability as well as fatigue process can be quantified and statistically evaluated. The integrated circuits with bonding wires and Kelvin probes were fabricated by ON Semiconductor Company in Belgium.

Anglický abstrakt

This short paper describes the experimental measurement setup for extraction of dynamical parameters of the encapsulated bond wires. Based on the proposed method a current carrying capability as well as fatigue process can be quantified and statistically evaluated. The integrated circuits with bonding wires and Kelvin probes were fabricated by ON Semiconductor Company in Belgium.

Klíčová slova

Electronic system, power supplies, precision measurement, switching networks.

Klíčová slova v angličtině

Electronic system, power supplies, precision measurement, switching networks.

Autoři

PETRŽELA, J.; ŠOTNER, R.; GÖTTHANS, T.; DŘÍNOVSKÝ, J.; KRATOCHVÍL, T.; WIEERS, A.

Rok RIV

2017

Vydáno

01.01.2016

Nakladatel

IFAC-PapersOnLine, ScienceDirect - Elsevier

Místo

Nizozemsko

ISBN

978-3-901608-46-9

Kniha

8th Vienna International Conference on Mathematical Modelling, MATHMOD 2015

ISSN

2405-8963

Periodikum

IFAC-PapersOnLine

Svazek

48

Číslo

1

Stát

Spojené království Velké Británie a Severního Irska

Strany od

936

Strany do

937

Strany počet

2

URL

http://ac.els-cdn.com/S2405896315001470/1-s2.0-S2405896315001470-main.pdf?_tid=cfe36658-c4e6-11e5-92f5-00000aacb361&acdnat=1453893311_fc70679186d2c8e433e81eb998b14555

BibTex

@inproceedings{BUT121250,
  author="Jiří {Petržela} and Roman {Šotner} and Tomáš {Götthans} and Jiří {Dřínovský} and Tomáš {Kratochvíl} and Aarnout {Wieers}",
  title="Measurement Setup for Identifying Parameters of the Encapsulated Bond Wires",
  booktitle="8th Vienna International Conference on Mathematical Modelling, MATHMOD 2015",
  year="2016",
  journal="IFAC-PapersOnLine",
  volume="48",
  number="1",
  pages="936--937",
  publisher="IFAC-PapersOnLine, ScienceDirect - Elsevier",
  address="Nizozemsko",
  doi="10.1016/j.ifacol.2015.05.146",
  isbn="978-3-901608-46-9",
  issn="2405-8971",
  url="http://ac.els-cdn.com/S2405896315001470/1-s2.0-S2405896315001470-main.pdf?_tid=cfe36658-c4e6-11e5-92f5-00000aacb361&acdnat=1453893311_fc70679186d2c8e433e81eb998b14555"
}