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Detail publikačního výsledku
SOMER, J.; ŠTEKOVIČ, M.; URBAN, F.; ŠANDERA, J.; SZENDIUCH, I.
Originální název
Bonding of zero-shrink LTCC with alumina ceramics
Anglický název
Druh
Článek WoS
Originální abstrakt
Low Temperature Co-fired Ceramic (LTCC) is widely used for manufacturing electrical systems in 3D configuration. LTCC substrates were so far bonded with alumina ceramics using additional adhesive layers with subsequent firing or curing cycle. With the advent of the zero-shrink LTCC substrates it is now possible to bond unfired substrates with other fired substrates; for example fired LTCC or alumina substrates. Alumina substrate in combination with LTCC brings advantages of good thermal conductivity for usage in heating elements or packaging. This paper is focused on a description of reliable bonding technique of zero-shrink LTCC and alumina ceramics.
Anglický abstrakt
Klíčová slova
low temperature co-fired ceramics (LTCC), Alumina Ceramics, thick film pastes, Cold Chemical Lamination
Klíčová slova v angličtině
Autoři
Rok RIV
2016
Vydáno
04.08.2015
Nakladatel
Emerald Group Publishing Limited
ISSN
0954-0911
Periodikum
SOLDERING & SURFACE MOUNT TECHNOLOGY
Svazek
27
Číslo
4
Stát
Spojené království Velké Británie a Severního Irska
Strany od
157
Strany do
163
Strany počet
7
URL
http://www.emeraldinsight.com/doi/abs/10.1108/SSMT-10-2014-0021
BibTex
@article{BUT115431, author="Jakub {Somer} and Michal {Štekovič} and František {Urban} and Josef {Šandera} and Ivan {Szendiuch}", title="Bonding of zero-shrink LTCC with alumina ceramics", journal="SOLDERING & SURFACE MOUNT TECHNOLOGY", year="2015", volume="27", number="4", pages="157--163", doi="10.1108/SSMT-10-2014-0021", issn="0954-0911", url="http://www.emeraldinsight.com/doi/abs/10.1108/SSMT-10-2014-0021" }