Detail publikace
Thermal conductivity analysis of delaminated thin films by scanning thermal microscopy
MARTINEK, J. KLAPETEK, P. CIMRMAN, R. VALTR, M.
Originální název
Thermal conductivity analysis of delaminated thin films by scanning thermal microscopy
Anglický název
Thermal conductivity analysis of delaminated thin films by scanning thermal microscopy
Jazyk
en
Originální abstrakt
Scanning thermal microscopy (SThM) is a scanning probe microscopy technique for mapping temperature and thermal properties of solid surfaces with very high resolution. Absolute determination of thermal conductivity using SThM, however, is still problematic due to the complex nature of the heat exchange between the probe and sample. In this paper we present a method for thin film thermal conductivity determination based on the use of thin film defects - delaminations by simulation of the measurement process using finite element method.
Anglický abstrakt
Scanning thermal microscopy (SThM) is a scanning probe microscopy technique for mapping temperature and thermal properties of solid surfaces with very high resolution. Absolute determination of thermal conductivity using SThM, however, is still problematic due to the complex nature of the heat exchange between the probe and sample. In this paper we present a method for thin film thermal conductivity determination based on the use of thin film defects - delaminations by simulation of the measurement process using finite element method.
Dokumenty
BibTex
@article{BUT112003,
author="Jan {Martinek} and Petr {Klapetek} and Robert {Cimrman} and Miroslav {Valtr}",
title="Thermal conductivity analysis of delaminated thin films by scanning thermal microscopy",
annote="Scanning thermal microscopy (SThM) is a scanning probe microscopy technique for mapping temperature and thermal properties of solid surfaces with very high resolution. Absolute determination of thermal conductivity using SThM, however, is still problematic due to the complex nature of the heat exchange between the probe and sample. In this paper we present a method for thin film thermal conductivity determination based on the use of thin film defects - delaminations by simulation of the measurement process using finite element method.",
chapter="112003",
doi="10.1088/0957-0233/25/4/044022",
number="4",
volume="25",
year="2014",
month="march",
pages="1--12",
type="journal article in Web of Science"
}