Detail publikačního výsledku

REMOVING HEAT FROM THERMAL SOURCE TO HEAT SINK THROUGH PRINTED CIRCUIT BOARD

MAKKI, Z.; JANDA, M.

Originální název

REMOVING HEAT FROM THERMAL SOURCE TO HEAT SINK THROUGH PRINTED CIRCUIT BOARD

Anglický název

REMOVING HEAT FROM THERMAL SOURCE TO HEAT SINK THROUGH PRINTED CIRCUIT BOARD

Druh

Stať ve sborníku v databázi WoS či Scopus

Originální abstrakt

The paper is focused on showing the possibility of an efficient heat removal from a thermal source to a heat sink via printed circuit board (PCB). Each solution can be described by hand calculation and simulation by Ansys Icepak software with using thermal resistance.

Anglický abstrakt

The paper is focused on showing the possibility of an efficient heat removal from a thermal source to a heat sink via printed circuit board (PCB). Each solution can be described by hand calculation and simulation by Ansys Icepak software with using thermal resistance.

Klíčová slova

Ansys Icepak, PCB (Printed circuit board), Heat conduction, Heat spread

Klíčová slova v angličtině

Ansys Icepak, PCB (Printed circuit board), Heat conduction, Heat spread

Autoři

MAKKI, Z.; JANDA, M.

Vydáno

25.06.2014

Místo

Jasná, Slovak Republic

ISBN

978-80-905525-1-7

Kniha

22nd SVSFEM ANSYS Users' Group Meeting and Conference 2014

Strany od

114

Strany do

118

Strany počet

172

BibTex

@inproceedings{BUT109897,
  author="Zbyněk {Makki} and Marcel {Janda}",
  title="REMOVING HEAT FROM THERMAL SOURCE TO HEAT SINK THROUGH PRINTED CIRCUIT BOARD",
  booktitle="22nd SVSFEM ANSYS Users' Group Meeting and Conference 2014",
  year="2014",
  number="1",
  pages="114--118",
  address="Jasná, Slovak 
Republic",
  isbn="978-80-905525-1-7"
}