Detail publikačního výsledku

Connection of electronic and microelectronic modules

ŠANDERA, J.

Originální název

Connection of electronic and microelectronic modules

Anglický název

Connection of electronic and microelectronic modules

Druh

Článek WoS

Originální abstrakt

The purpose of this article is to describe the design of electronic and microelectronic modules and, in particular, it focuses on connecting system of electrical modules to the main board of printed board. The theory of thermomechanical loading of system is presented. New methods of rigid solder connection for electronic modules are also presented.

Anglický abstrakt

The purpose of this article is to describe the design of electronic and microelectronic modules and, in particular, it focuses on connecting system of electrical modules to the main board of printed board. The theory of thermomechanical loading of system is presented. New methods of rigid solder connection for electronic modules are also presented.

Klíčová slova

Connection with component; Electronic and microelectronic modules; Flexible connection; Rigid connection

Klíčová slova v angličtině

Connection with component; Electronic and microelectronic modules; Flexible connection; Rigid connection

Autoři

ŠANDERA, J.

Rok RIV

2015

Vydáno

27.05.2014

Nakladatel

Emerald Group

Místo

England

ISSN

1356-5362

Periodikum

MICROELECTRONICS INTERNATIONAL

Svazek

31

Číslo

2

Stát

Spojené království Velké Británie a Severního Irska

Strany od

86

Strany do

89

Strany počet

4

BibTex

@article{BUT107696,
  author="Josef {Šandera}",
  title="Connection of electronic and microelectronic modules",
  journal="MICROELECTRONICS INTERNATIONAL",
  year="2014",
  volume="31",
  number="2",
  pages="86--89",
  doi="10.1108/MI-10-2013-0053",
  issn="1356-5362"
}