Detail publikačního výsledku

Connection of Electronic and Microelectronic Modules

ŠANDERA, J.

Originální název

Connection of Electronic and Microelectronic Modules

Anglický název

Connection of Electronic and Microelectronic Modules

Druh

Stať ve sborníku v databázi WoS či Scopus

Originální abstrakt

Design electronic and microelectronic modules, owerlook of actual connection, new connections (connection with chip components)

Anglický abstrakt

Design electronic and microelectronic modules, owerlook of actual connection, new connections (connection with chip components)

Klíčová slova

electronic module, thermomechanical reliability, flexible connection, rigid connection, connection with chip component

Klíčová slova v angličtině

electronic module, thermomechanical reliability, flexible connection, rigid connection, connection with chip component

Autoři

ŠANDERA, J.

Rok RIV

2014

Vydáno

22.09.2013

Nakladatel

IMAPS Poland Chapter

Místo

Krakow

ISBN

978-83-932464-1-0

Kniha

Proceedings of 37th International Microelectronic and Packaging IMAPS-CPMT Poland Conference, 22-25 September 2013, Krakow, Poland

Strany od

1

Strany do

5

Strany počet

5

BibTex

@inproceedings{BUT104007,
  author="Josef {Šandera}",
  title="Connection of Electronic and Microelectronic Modules",
  booktitle="Proceedings of 37th International Microelectronic and Packaging IMAPS-CPMT Poland Conference, 22-25 September 2013, Krakow, Poland",
  year="2013",
  pages="1--5",
  publisher="IMAPS Poland Chapter",
  address="Krakow",
  isbn="978-83-932464-1-0"
}