Detail publikačního výsledku

Usage of LTCC Technology in Electronic Packaging

PSOTA, B.; KLÍMA, M.; NICÁK, M.; SZENDIUCH, I.

Originální název

Usage of LTCC Technology in Electronic Packaging

Anglický název

Usage of LTCC Technology in Electronic Packaging

Druh

Článek recenzovaný mimo WoS a Scopus

Originální abstrakt

The paper deals with the new type of the package creation, where the LTCC technology is used for this purpose. Complete process of the package design as well as manufacture of the package is described.

Anglický abstrakt

The paper deals with the new type of the package creation, where the LTCC technology is used for this purpose. Complete process of the package design as well as manufacture of the package is described.

Klíčová slova

LTCC, package, ANSYS

Klíčová slova v angličtině

LTCC, package, ANSYS

Autoři

PSOTA, B.; KLÍMA, M.; NICÁK, M.; SZENDIUCH, I.

Rok RIV

2014

Vydáno

25.06.2013

ISSN

2161-2528

Periodikum

Conference proceedings (International Spring Seminar on Electronics Technology)

Svazek

36

Číslo

2013

Stát

Spojené státy americké

Strany od

206

Strany do

209

Strany počet

4

BibTex

@article{BUT100235,
  author="Boleslav {Psota} and Martin {Klíma} and Michal {Nicák} and Ivan {Szendiuch}",
  title="Usage of LTCC Technology in Electronic Packaging",
  journal="Conference proceedings (International Spring Seminar on Electronics Technology)",
  year="2013",
  volume="36",
  number="2013",
  pages="206--209",
  issn="2161-2528"
}