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Detail publikačního výsledku
PÁLESCH, E.; KONTÁROVÁ, S.; ČECH, V.
Originální název
Mechanical properties of plasma polymer films controlled by RF power
Anglický název
Druh
Stať ve sborníku v databázi WoS či Scopus
Originální abstrakt
This study deals with plasma polymer films deposited on silicon substrates using tetravinylsilane monomer. The deposition technique was plasma-enhanced chemical vapour deposition. Nanoindentation was used as a method to investigate mechanical properties of samples prepared at different RF powers. The Youngs modulus and hardness of thin films were estimated from load-displacement curves. The nanoscratch test was employed to determine the critical normal load needed for film delamination, as a parameter describing adhesion to the substrate. AFM images of scratches were carried out to correlate the data with nature and shape of scratches.
Anglický abstrakt
Klíčová slova
Thin films, plasma polymer, mechanical properties, nanoindentation, nanoscratch test
Klíčová slova v angličtině
Autoři
Vydáno
17.12.2012
Kniha
Proc. 13th Int. Conf. Plasma Surface Engineering
Strany od
1
Strany do
4
Strany počet
BibTex
@inproceedings{BUT97296, author="Erik {Pálesch} and Soňa {Kontárová} and Vladimír {Čech}", title="Mechanical properties of plasma polymer films controlled by RF power", booktitle="Proc. 13th Int. Conf. Plasma Surface Engineering", year="2012", pages="1--4" }