Detail publikačního výsledku

Experimental study of glass frit bonding

PEKÁREK, J.; VRBA, R.; PRÁŠEK, J.; CHOMOUCKÁ, J.

Originální název

Experimental study of glass frit bonding

Anglický název

Experimental study of glass frit bonding

Druh

Stať ve sborníku v databázi WoS či Scopus

Originální abstrakt

Glass frit bonding technology provides a wide range of possibilities for the bonding of wafers at process temperatures below 450 C. The process consists of three main steps: screen-printing of the glass paste, thermal conditioning and thermo-compressive bonding. The structured bonding layer protects moveable structures from parasitic bonding. Almost all surface layers commonly used in silicon micromachining can be bonded using glass frits. The main advantages of glass frit bonding are hermetic sealing, high process yield, low mechanical stress at the bonding interface, high bonding strength, and good reliability.

Anglický abstrakt

Glass frit bonding technology provides a wide range of possibilities for the bonding of wafers at process temperatures below 450 C. The process consists of three main steps: screen-printing of the glass paste, thermal conditioning and thermo-compressive bonding. The structured bonding layer protects moveable structures from parasitic bonding. Almost all surface layers commonly used in silicon micromachining can be bonded using glass frits. The main advantages of glass frit bonding are hermetic sealing, high process yield, low mechanical stress at the bonding interface, high bonding strength, and good reliability.

Klíčová slova

Glass frit, wafer bonding

Klíčová slova v angličtině

Glass frit, wafer bonding

Autoři

PEKÁREK, J.; VRBA, R.; PRÁŠEK, J.; CHOMOUCKÁ, J.

Rok RIV

2013

Vydáno

30.05.2012

Nakladatel

Mendelova univerzita v Brně

Místo

Brno

ISBN

978-80-7375-618-5

Kniha

XII. Pracovní setkání fyzikálních chemiků a elektrochemiků

Strany od

214

Strany do

215

Strany počet

2

BibTex

@inproceedings{BUT92579,
  author="Jan {Pekárek} and Radimír {Vrba} and Jan {Prášek} and Jana {Pekárková}",
  title="Experimental study of glass frit bonding",
  booktitle="XII. Pracovní setkání fyzikálních chemiků a elektrochemiků",
  year="2012",
  number="1.",
  pages="214--215",
  publisher="Mendelova univerzita v Brně",
  address="Brno",
  isbn="978-80-7375-618-5"
}