Detail publikačního výsledku

Cement-bonded chip boards using hemp and energy by-products in civil engineering

MELICHAR, T.; BYDŽOVSKÝ, J.; KEPRDOVÁ, Š.

Originální název

Cement-bonded chip boards using hemp and energy by-products in civil engineering

Anglický název

Cement-bonded chip boards using hemp and energy by-products in civil engineering

Druh

Článek recenzovaný mimo WoS a Scopus

Originální abstrakt

The aim of the research presented in this article was studying the basic physico-mechanical parameters of cement-bonded chip boards with hemp used as filler and by-products of energy production applied when modifying the bonding component.

Anglický abstrakt

The aim of the research presented in this article was studying the basic physico-mechanical parameters of cement-bonded chip boards with hemp used as filler and by-products of energy production applied when modifying the bonding component.

Klíčová slova

Cement-bonded chip board, energy by-product, physical and mechanical parameters, organic substance.

Klíčová slova v angličtině

Cement-bonded chip board, energy by-product, physical and mechanical parameters, organic substance.

Autoři

MELICHAR, T.; BYDŽOVSKÝ, J.; KEPRDOVÁ, Š.

Rok RIV

2013

Vydáno

14.05.2012

ISSN

1022-6680

Periodikum

Advanced Materials Research

Svazek

2012

Číslo

512-515

Stát

Švýcarská konfederace

Strany od

2956

Strany do

2960

Strany počet

5

BibTex

@article{BUT92536,
  author="Tomáš {Melichar} and Jiří {Bydžovský} and Šárka {Keprdová}",
  title="Cement-bonded chip boards using hemp and energy by-products in civil engineering",
  journal="Advanced Materials Research",
  year="2012",
  volume="2012",
  number="512-515",
  pages="2956--2960",
  issn="1022-6680"
}