Detail publikačního výsledku

Modeling of Microelectronic Structures and Packages using ANSYS Software

PSOTA, B.; SZENDIUCH, I.

Originální název

Modeling of Microelectronic Structures and Packages using ANSYS Software

Anglický název

Modeling of Microelectronic Structures and Packages using ANSYS Software

Druh

Konferenční sborník (ne stať)

Originální abstrakt

This paper informing about the modeling of BGA structures using ANSYS software. The FEA method is cleared up, but the main emphasis lays on mechanical stress issues. As example is shown the comparison of three different solders and described their usage for electronic components.

Anglický abstrakt

This paper informing about the modeling of BGA structures using ANSYS software. The FEA method is cleared up, but the main emphasis lays on mechanical stress issues. As example is shown the comparison of three different solders and described their usage for electronic components.

Klíčová slova

Mechanical stress, ANSYS, BGA, Simulation

Klíčová slova v angličtině

Mechanical stress, ANSYS, BGA, Simulation

Autoři

PSOTA, B.; SZENDIUCH, I.

Rok RIV

2012

Vydáno

16.05.2011

ISBN

978-1-4577-2111-3

BibTex

@proceedings{BUT73010,
  editor="Boleslav {Psota} and Ivan {Szendiuch}",
  title="Modeling of Microelectronic Structures and Packages using ANSYS Software",
  year="2011",
  isbn="978-1-4577-2111-3"
}