Detail publikačního výsledku

Environment-friendly LF Solder SAC 305 and Its Reliability

ŠVECOVÁ, O.; ŠANDERA, J.

Originální název

Environment-friendly LF Solder SAC 305 and Its Reliability

Anglický název

Environment-friendly LF Solder SAC 305 and Its Reliability

Druh

Abstrakt

Originální abstrakt

The article discusses the factors affecting the reliability and the longevity of soldering joints. It introduces the first results of the practical testing of the impact both of varied surfacing methods and the different base material's thickness on the longevity of soldering joints executed by the leadless solder SAC 305. The testing boards are periodically left open for the impact of the temperatures between 0 to +100, with the delay of 15 minutes at the maximum temperature. Before the test itself the boards were aged at increased temperature according to the standard of IPC-SM-785. The first gained experimental data - number of cycles before the failure - were evaluated with the help of Weibull distribution in a graphical form.

Anglický abstrakt

The article discusses the factors affecting the reliability and the longevity of soldering joints. It introduces the first results of the practical testing of the impact both of varied surfacing methods and the different base material's thickness on the longevity of soldering joints executed by the leadless solder SAC 305. The testing boards are periodically left open for the impact of the temperatures between 0 to +100, with the delay of 15 minutes at the maximum temperature. Before the test itself the boards were aged at increased temperature according to the standard of IPC-SM-785. The first gained experimental data - number of cycles before the failure - were evaluated with the help of Weibull distribution in a graphical form.

Klíčová slova

Lead-free solder, solder joint, reliability, Weibull distribution

Klíčová slova v angličtině

Lead-free solder, solder joint, reliability, Weibull distribution

Autoři

ŠVECOVÁ, O.; ŠANDERA, J.

Rok RIV

2010

Vydáno

13.05.2009

Nakladatel

Novpress s.r.o.

Místo

Brno

ISBN

978-80-214-3874-3

Kniha

ISSE 2009 32nd International Spring Seminar on Electronics Technology. 2009. Hetero System Integration, the path to New Solutions in the Modern Electronics. Abstracts Proceedings.

Strany od

200

Strany do

201

Strany počet

2

BibTex

@misc{BUT60592,
  author="Olga {Švecová} and Josef {Šandera}",
  title="Environment-friendly LF Solder SAC 305 and Its Reliability",
  booktitle="ISSE 2009 32nd International Spring Seminar on Electronics Technology. 2009. Hetero System Integration, the path to New Solutions in the Modern Electronics. Abstracts Proceedings.",
  year="2009",
  edition="1",
  pages="200--201",
  publisher="Novpress s.r.o.",
  address="Brno",
  isbn="978-80-214-3874-3",
  note="Abstract"
}