Detail publikačního výsledku

Numerical solution of phase change materials for thermal management of integrated circuit packages

FIALA, P.; STEINBAUER, M.; BĚHUNEK, I.

Originální název

Numerical solution of phase change materials for thermal management of integrated circuit packages

Anglický název

Numerical solution of phase change materials for thermal management of integrated circuit packages

Druh

Článek recenzovaný mimo WoS a Scopus

Originální abstrakt

An analytical description and solution of heat transfer, melting and freezing process in 1D applied to inorganic crystalline salts is presented. Numerical analysis of a real 3D model is also carried out. Some of the 3D results obtained by means of the finite element method were verified experimentally in the laboratory.

Anglický abstrakt

An analytical description and solution of heat transfer, melting and freezing process in 1D applied to inorganic crystalline salts is presented. Numerical analysis of a real 3D model is also carried out. Some of the 3D results obtained by means of the finite element method were verified experimentally in the laboratory.

Klíčová slova

Phase change, finite element method, heat transfer, integrated circuit

Klíčová slova v angličtině

Phase change, finite element method, heat transfer, integrated circuit

Autoři

FIALA, P.; STEINBAUER, M.; BĚHUNEK, I.

Rok RIV

2010

Vydáno

30.11.2008

Nakladatel

Institute of thermomechanics AS CR

Místo

Praha, CR

ISSN

0001-7043

Periodikum

Acta Technica ČSAV

Svazek

53

Číslo

1

Stát

Česká republika

Strany od

295

Strany do

308

Strany počet

14

BibTex

@article{BUT49679,
  author="Pavel {Fiala} and Miloslav {Steinbauer} and Ivo {Běhunek}",
  title="Numerical solution of phase change materials for thermal management of integrated circuit packages",
  journal="Acta Technica ČSAV",
  year="2008",
  volume="53",
  number="1",
  pages="295--308",
  issn="0001-7043"
}