Detail publikačního výsledku

MSM System in Package - One Way to System Integration

SZENDIUCH, I.

Originální název

MSM System in Package - One Way to System Integration

Anglický název

MSM System in Package - One Way to System Integration

Druh

Stať ve sborníku v databázi WoS či Scopus

Originální abstrakt

The stacked packages are one of the most significant advances for building modern electronic systems. They give a good oportunity to built a high volume 3D devices with requested quality.

Anglický abstrakt

The stacked packages are one of the most significant advances for building modern electronic systems. They give a good oportunity to built a high volume 3D devices with requested quality.

Klíčová slova

MSM, SOC, CSP, SIP

Klíčová slova v angličtině

MSM, SOC, CSP, SIP

Autoři

SZENDIUCH, I.

Vydáno

01.05.2002

Nakladatel

TYPOS-Digital Print

Místo

Praha

ISBN

0-7803-9824-6

Kniha

ISSE 2002

Strany od

266

Strany počet

3

BibTex

@inproceedings{BUT4778,
  author="Ivan {Szendiuch}",
  title="MSM System in Package - One Way to System Integration",
  booktitle="ISSE 2002",
  year="2002",
  number="1",
  pages="3",
  publisher="TYPOS-Digital Print",
  address="Praha",
  isbn="0-7803-9824-6"
}