Detail publikačního výsledku

Phase Change Materials for Thermal Management of IC Packages

FIALA, P.; BĚHUNEK, I.

Originální název

Phase Change Materials for Thermal Management of IC Packages

Anglický název

Phase Change Materials for Thermal Management of IC Packages

Druh

Článek recenzovaný mimo WoS a Scopus

Originální abstrakt

This paper deals with the application of phase change materials (PCM) for thermal management of inte-grated circuits as a viable alternative to active forced con-vection cooling systems. The paper presents an analytical description and solution of heat transfer, melting and freezing process in 1D which is applied to inorganic crystalline salts. There are also results of numerical simulation of a real 3D model. These results were obtained by means of the finite element method (FEM). Results of 3D numerical solutions were verified experimentally.

Anglický abstrakt

This paper deals with the application of phase change materials (PCM) for thermal management of inte-grated circuits as a viable alternative to active forced con-vection cooling systems. The paper presents an analytical description and solution of heat transfer, melting and freezing process in 1D which is applied to inorganic crystalline salts. There are also results of numerical simulation of a real 3D model. These results were obtained by means of the finite element method (FEM). Results of 3D numerical solutions were verified experimentally.

Klíčová slova

Phase change, FEM, heat, integrated circuit.

Klíčová slova v angličtině

Phase change, FEM, heat, integrated circuit.

Autoři

FIALA, P.; BĚHUNEK, I.

Rok RIV

2010

Vydáno

01.06.2007

Nakladatel

VUT - FEKT, Dept. of Radio Electronics

Místo

Purkyňova 118, 61200 Brno

ISSN

1210-2512

Periodikum

Radioengineering

Svazek

2007 (16)

Číslo

2

Stát

Česká republika

Strany od

50

Strany do

55

Strany počet

6

URL

http://www.radioeng.cz

BibTex

@article{BUT44299,
  author="Pavel {Fiala} and Ivo {Běhunek}",
  title="Phase Change Materials for Thermal Management of IC Packages",
  journal="Radioengineering",
  year="2007",
  volume="2007 (16)",
  number="2",
  pages="50--55",
  issn="1210-2512",
  url="http://www.radioeng.cz"
}